Fluidic heterogeneous microsystems assembly and packaging

• Published in: Journal of microelectromechanical systems Vol. 15; no. 4; pp. 864 - 870
• Main Authors: Wei Zheng, Jaehoon Chung, Jacobs, H.O.
• Format: Journal Article
• Language: English
• Published: New York, NY IEEE 01.08.2006; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Applied sciences; Assembly; Autonomous; Circuits; Cross-disciplinary physics: materials science; rheology; Devices; Electronics; Encapsulation; Exact sciences and technology; Fluidic microsystems; Heterogeneous integration; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Light emitting diodes; Materials science; Mechanical engineering. Machine design; Mechanical instruments, equipment and techniques; Methods of nanofabrication; Microelectronic fabrication (materials and surfaces technology); Microfluidics; Micromechanical devices and systems; Packaging; Physics; Precision engineering, watch making; Segments; Self assembly; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Sensor systems; Sensors; sequential self-assembly; Shape; Shape recognition; solder- and shape-directed self-assembly; Three dimensional; Encapsulation; Autonomous system; Self assembly; Geometrical shape; Gallium arsenides; Measurement sensor; sequential self-assembly; Experimental study; Telemetry; Electrical connection; Liquid metal; Metal coating; sensor systems; Sequential method; Complementary MOS technology; Defect; Heterogeneous integration; Soldering; solder- and shape-directed self-assembly; Microelectromechanical device; Fluidics
• ISSN: 1057-7157; 1941-0158
• DOI: 10.1109/JMEMS.2006.878885

The nonrobotic fabrication of packaged microsystems that contain nonidentical parts has been accomplished by a directed self-assembly process. The self-assembly process uses geometrical shape recognition to identify different components and subsequent bond formation between liquid solder and metal-coated areas to form mechanical and electrical connections. We applied this concept of shape recognition and subsequent formation of contacts to assemble and package microsystems that contained nonidentical subunits. The self-assembly of three-component assemblies is demonstrated by sequentially adding device segments to the assembly solution including 200-mum-sized light-emitting diodes. Six hundred AlGaInP-GaAs light-emitting diode segments self-assembled onto device carriers in 2min without defects. Encapsulation units self-assembled onto the LED-carrier assemblies to form a three-dimensional (3-D) circuit path to operate the final device. The reported procedure provides a new route to the creation of autonomous heterogeneous microsystems including the realization of autonomous wireless sensor system that requires nonidentical units: CMOS circuitry, Non-CMOS sensor unit for sensing, III-V components for communication, and encapsulation units to form 3-D electrical interconnects. The creation of such systems is being discussed and a proof of concept experiment is being demonstrated