Evaluation of shear bond strength of repair acrylic resin to Co-Cr alloy

• Published in: The journal of advanced prosthodontics Vol. 6; no. 4; pp. 272 - 277
• Main Authors: Külünk, Safak, Külünk, Tolga, Saraç, Duygu, Cengiz, Seda, Baba, Seniha
• Format: Journal Article
• Language: English
• Published: Korea (South) The Korean Academy of Prosthodontics 01.08.2014; 대한치과보철학회
• Subjects: Original; 치의학; Repair acrylic resin; Repair strength; Co-Cr alloy
• ISSN: 2005-7806; 2005-7814
• DOI: 10.4047/jap.2014.6.4.272

The purpose of this study was to investigate the impact of different surface treatment methods and thermal ageing on the bond strength of autopolymerizing acrylic resin to Co-Cr. Co-Cr alloy specimens were divided into five groups according to the surface conditioning methods. C: No treatment; SP: flamed with the Silano-Pen device; K: airborne particle abrasion with Al2O3; Co: airborne particle abrasion with silica-coated Al2O3; KSP: flamed with the Silano-Pen device after the group K experimental protocol. Then, autopolymerized acrylic resin was applied to the treated specimen surfaces. All the groups were divided into two subgroups with the thermal cycle and water storage to determine the durability of the bond. The bond strength test was applied in an universal test machine and treated Co-Cr alloys were analyzed by scanning electron microscope (SEM). Two-way analysis of variance (ANOVA) was used to determine the significant differences among surface treatments and thermocycling. Their interactons were followed by a multiple comparison' test performed uing a post hoc Tukey HSD test (α=.05). Surface treatments significantly increased repair strengths of repair resin to Co-Cr alloy. The repair strengths of Group K, and Co significantly decreased after 6,000 cycles (P<.001). Thermocycling lead to a significant decrease in shear bond strength for air abrasion with silica-coated aluminum oxide particles. On the contrary, flaming with Silano-Pen did not cause a significant reduction in adhesion after thermocycling.