Coating strategies for atomic layer deposition

• Published in: Nanotechnology reviews (Berlin) Vol. 6; no. 6; pp. 527 - 547
• Main Authors: Hu, Liang, Qi, Weihong, Li, Yejun
• Format: Journal Article
• Language: English
• Published: Berlin De Gruyter 27.11.2017; Walter de Gruyter GmbH
• Subjects: atomic layer deposition; Atomic layer epitaxy; Coating; coating strategy; Fabrication; Film thickness; Literature reviews; Nanomaterials; Nanostructure; nanostructured materials; Nanotechnology; Reactors; Reviews; State-of-the-art reviews; Surface activation; Surface reactions; Vapor phases
• ISSN: 2191-9089; 2191-9097
• DOI: 10.1515/ntrev-2017-0149

Atomic layer deposition (ALD) is a vapor phase technique capable of producing a variety of materials. It consists of the alternation of separate self-limiting surface reactions, which enables accurate control of film thickness at the Angstrom level. ALD becomes a powerful tool for a lot of industrial and research applications. Coating strategies are the key for ALD; however, there are few systematic reviews concerning coating strategies for ALD. This review provides a detailed summary of state-of-the-art coating strategies in ALD, emphasizing the recent progress in the fabrication of novel nanostructures. The progress in coating strategies is reviewed in three parts: template-assisted preparation of low-dimensional nanomaterials and complex nanostructures; surface treatments, including the surface activation and the surface blocking ways; enhanced reactor, such as plasma and fluid bed reactor, and improved growth method such as the ABC-type model. In addition, we also discussed the challenges facing the coating method for ALD.