Power and Reliability Management of SoCs
Today's embedded systems integrate multiple IP cores for processing, communication, and sensing on a single die as systems-on-chip (SoCs). Aggressive transistor scaling, decreased voltage margins and increased processor power and temperature have made reliability assessment a much more signific...
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Published in | IEEE transactions on very large scale integration (VLSI) systems Vol. 15; no. 4; pp. 391 - 403 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Piscataway, NJ
IEEE
01.04.2007
Institute of Electrical and Electronics Engineers The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | Today's embedded systems integrate multiple IP cores for processing, communication, and sensing on a single die as systems-on-chip (SoCs). Aggressive transistor scaling, decreased voltage margins and increased processor power and temperature have made reliability assessment a much more significant issue. Although reliability of devices and interconnect has been broadly studied, in this work, we study a tradeoff between reliability and power consumption for component-based SoC designs. We specifically focus on hard error rates as they cause a device to permanently stop operating. We also present a joint reliability and power management optimization problem whose solution is an optimal management policy. When careful joint policy optimization is performed, we obtain a significant improvement in energy consumption (40%) in tandem with meeting a reliability constraint for all SoC operating temperatures |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 ObjectType-Article-2 ObjectType-Feature-1 |
ISSN: | 1063-8210 1557-9999 |
DOI: | 10.1109/TVLSI.2007.895245 |