Device and Integration Technology for Silicon Photonic Transmitters

• Published in: IEEE journal of selected topics in quantum electronics Vol. 17; no. 3; pp. 671 - 688
• Main Authors: Hyundai Park, Sysak, M N, Hui-Wen Chen, Fang, A W, Di Liang, Ling Liao, Koch, B R, Bovington, J, Yongbo Tang, Wong, K, Jacob-Mitos, M, Jones, R, Bowers, J E
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.05.2011; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Bioengineering; Bioteknik; CMOS; Devices; Electrical engineering, electronics and photonics; Elektroteknik, elektronik och fotonik; Fysik; Gratings; Immunology engineering; Immunteknik; Laser arrays; Lasers; Measurement by laser beam; Modulators; NATURAL SCIENCES; NATURVETENSKAP; Optical waveguides; Optics; Optik; Optoelectronic devices; Other physics; photonic integration; Photonics; Physics; semiconductor lasers; Silicon; silicon photonics; Spectra; TECHNOLOGY; TEKNIKVETENSKAP; Transmitters; Waveguide lasers; Övrig fysik
• ISSN: 1077-260X; 1558-4542; 1558-4542
• DOI: 10.1109/JSTQE.2011.2106112

The device and integration technology for silicon photonic transmitters are reviewed in this paper. The hybrid silicon platform enables on-chip lasers to be fabricated with silicon photonic circuits and can be integrated in the CMOS back-end flow. Laser arrays from multiple die bonding and quantum well intermixing techniques are demonstrated to extend the spectral bandwidth from the laser array of the transmitter. Two modulator technologies, silicon modulators and hybrid silicon modulators, are also described.