Study of the physicochemical and pasting properties of instant corn flour added with calcium and fibers from nopal powder
This work presents a physicochemical and apparent viscosity characterization of commercial nixtamalized corn flours (CNCF) added with nopal powder. The chemical proximate analysis of CNCF and traditional nixtamalized corn flours (TNCF) shows equal amounts of protein and fat, but the calcium content...
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Published in | Journal of food engineering Vol. 96; no. 3; pp. 401 - 409 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Oxford
Elsevier Ltd
01.02.2010
[New York, NY]: Elsevier Science Pub. Co Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | This work presents a physicochemical and apparent viscosity characterization of commercial nixtamalized corn flours (CNCF) added with nopal powder. The chemical proximate analysis of CNCF and traditional nixtamalized corn flours (TNCF) shows equal amounts of protein and fat, but the calcium content and total dietary fiber is higher in the TNCF. Nopal powder contains a high amount of Ca, soluble and insoluble fiber. The inclusion of 4% of nopal powder increases the calcium and fiber content of the CNCF to the level of traditional nixtamalized products steeped at 7
h. A pasting characteristics analysis based on the profile curves was done in order to study the influence of soluble and insoluble fibers on the pasting conditions of the studied samples added with nopal. At low temperatures the insoluble fiber governs the water absorption and below the gelatinization temperature (
T
g) a competition between starch swelling and water absorption was found; for
T higher than
T
g the system is complex because it includes the interactions between soluble–insoluble fibers and exuding amylose. |
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Bibliography: | http://dx.doi.org/10.1016/j.jfoodeng.2009.08.014 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0260-8774 1873-5770 |
DOI: | 10.1016/j.jfoodeng.2009.08.014 |