Application of BPDA/PDA Polyimide Films in Multi-chip Modules (MCM)

Polyimides are widely used as dielectrics in high density multi-chip module (MCM) wiring systems in order to adjust the thermal expansion between LSI chips and substrates. In these MCMs, Copper is commonly used for vias which interconnects different layers. In these structures, there are some drawba...

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Bibliographic Details
Published inJournal of Photopolymer Science and Technology Vol. 11; no. 2; pp. 253 - 256
Main Authors Ishizuki, Yoshikatsu, Yokouchi, Kishio, Yoneda, Yasuhiro
Format Journal Article
LanguageEnglish
Published Hiratsuka The Society of Photopolymer Science and Technology(SPST) 1998
Japan Science and Technology Agency
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Summary:Polyimides are widely used as dielectrics in high density multi-chip module (MCM) wiring systems in order to adjust the thermal expansion between LSI chips and substrates. In these MCMs, Copper is commonly used for vias which interconnects different layers. In these structures, there are some drawbacks which adversely affect the multi-layer wiring system. Among them, a major problem is that in order to get a high wiring density, a large number of vias with a very small via diameter have to be created. However, if there are large number of vias, due to the Z-directional thermal expansion mismatch of Cu and the dielectric, stress concentrated around vias leading to fracture and crank formation in the dielectric. Therefore, in this paper, in order to find a promising dielectric material, to the utilized in MCMs, the Z-directional coefficient of thermal expansion (CTE) of polyimide films prepared with different processing conditions was investigated. The Z-directional CTE of the films was measured by the laser interferometric technique.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.11.253