Polyethersulfone-epoxy terminated materials as thermosetting resins for microelectronic devices

• Published in: Journal of polymer science. Part A, Polymer chemistry Vol. 47; no. 21; pp. 5682 - 5689
• Main Authors: Scamporrino, Emilio, Mineo, Placido, Scamporrino, Andrea, Dattilo, Sandro, Vitalini, Daniele, Alicata, Rossana
• Format: Journal Article
• Language: English
• Published: Wiley Subscription Services, Inc., A Wiley Company 01.11.2009
• ISSN: 0887-624X; 1099-0518
• DOI: 10.1002/pola.23611

A totally aromatic polyether/sulfone resin (PES-E) was synthesized and tested as an insulating glue in the construction of a Chip-on-Chip (CoC) device. PES-E, essentially constituted of open-chain macromolecules of low molecular mass (Mn of about 3000 Da) with hydroxy and/or epoxy end-groups, has a glass transition temperature of about 150 °C and is subject to crosslinking at temperatures higher than 320 °C. A CoC device was assembled using a five-step process by interposing a layer of PES-E between two chips. After curing, SEM cross section images showed a homogeneous crosslinked resin layer well stuck (flick and shear tests) to both chips. The chemical structure of the chains and the hydroxy/epoxy end-groups ratio were optimized to obtain a crosslinked material with good adhesion and sufficient flexibility to avoid cracking during assembly and use.