Investigation of improved adhesion between Cu film and polyimide by the PSII-EIAMAD technique
Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In PSII, a substrate is immersed in the plasma, and negative, high‐voltage pulses are applied to accelerate ions into the substrate in order to...
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Published in | Surface and interface analysis Vol. 38; no. 4; pp. 343 - 347 |
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Main Authors | , , , |
Format | Journal Article Conference Proceeding |
Language | English |
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Chichester, UK
John Wiley & Sons, Ltd
01.04.2006
Wiley |
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Abstract | Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In PSII, a substrate is immersed in the plasma, and negative, high‐voltage pulses are applied to accelerate ions into the substrate in order to modify the surface properties of materials.
PSII technique combined with energetic ion‐assisted mixing and deposition (EIAMAD) was used to improve the adhesion between the Cu film and polyimide. Cu films processed with ion‐assisted mixing showed higher adhesion strength than that of not processed or plasma‐cleaned ones. Cu films on polyimide substrate were deposited by using different ion species to investigate the ion effect on the interface mixing. Argon ion bombardment led to more adhesive and gradient layers as a function of ion energy and ion dose. The adhesion strength was determined by the 90° peel test. The characterization of Cu‐deposited polyimide, generated with ion‐assisted mixing by PSII, was performed by AES, SEM, and AFM. Our results suggested that PSII‐EIAMAD was a very useful method to grow Cu films with good adhesion properties on polyimide at room temperature. Copyright © 2006 John Wiley & Sons, Ltd. |
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AbstractList | Abstract
Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In PSII, a substrate is immersed in the plasma, and negative, high‐voltage pulses are applied to accelerate ions into the substrate in order to modify the surface properties of materials.
PSII technique combined with energetic ion‐assisted mixing and deposition (EIAMAD) was used to improve the adhesion between the Cu film and polyimide. Cu films processed with ion‐assisted mixing showed higher adhesion strength than that of not processed or plasma‐cleaned ones. Cu films on polyimide substrate were deposited by using different ion species to investigate the ion effect on the interface mixing. Argon ion bombardment led to more adhesive and gradient layers as a function of ion energy and ion dose. The adhesion strength was determined by the 90° peel test. The characterization of Cu‐deposited polyimide, generated with ion‐assisted mixing by PSII, was performed by AES, SEM, and AFM. Our results suggested that PSII‐EIAMAD was a very useful method to grow Cu films with good adhesion properties on polyimide at room temperature. Copyright © 2006 John Wiley & Sons, Ltd. Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In PSII, a substrate is immersed in the plasma, and negative, high‐voltage pulses are applied to accelerate ions into the substrate in order to modify the surface properties of materials. PSII technique combined with energetic ion‐assisted mixing and deposition (EIAMAD) was used to improve the adhesion between the Cu film and polyimide. Cu films processed with ion‐assisted mixing showed higher adhesion strength than that of not processed or plasma‐cleaned ones. Cu films on polyimide substrate were deposited by using different ion species to investigate the ion effect on the interface mixing. Argon ion bombardment led to more adhesive and gradient layers as a function of ion energy and ion dose. The adhesion strength was determined by the 90° peel test. The characterization of Cu‐deposited polyimide, generated with ion‐assisted mixing by PSII, was performed by AES, SEM, and AFM. Our results suggested that PSII‐EIAMAD was a very useful method to grow Cu films with good adhesion properties on polyimide at room temperature. Copyright © 2006 John Wiley & Sons, Ltd. Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In PSII, a substrate is immersed in the plasma, and negative, high-voltage pulses are applied to accelerate ions into the substrate in order to modify the surface properties of materials. PSII technique combined with energetic ion-assisted mixing and deposition (EIAMAD) was used to improve the adhesion between the Cu film and polyimide. Cu films processed with ion-assisted mixing showed higher adhesion strength than that of not processed or plasma-cleaned ones. Cu films on polyimide substrate were deposited by using different ion species to investigate the ion effect on the interface mixing. Argon ion bombardment led to more adhesive and gradient layers as a function of ion energy and ion dose. The adhesion strength was determined by the 90DG peel test. The characterization of Cu-deposited polyimide, generated with ion-assisted mixing by PSII, was performed by AES, SEM, and AFM. Our results suggested that PSII-EIAMAD was a very useful method to grow Cu films with good adhesion properties on polyimide at room temperature. |
Author | Lee, Yeonhee Hong, Ju Hi Chun, Hyejin Han, Seunghee |
Author_xml | – sequence: 1 givenname: Yeonhee surname: Lee fullname: Lee, Yeonhee email: yhlee@kist.re.kr organization: Advanced Analysis Center, Korea Institute of Science and Technology, Seoul 136-791, Korea – sequence: 2 givenname: Ju Hi surname: Hong fullname: Hong, Ju Hi organization: Advanced Analysis Center, Korea Institute of Science and Technology, Seoul 136-791, Korea – sequence: 3 givenname: Hyejin surname: Chun fullname: Chun, Hyejin organization: Advanced Analysis Center, Korea Institute of Science and Technology, Seoul 136-791, Korea – sequence: 4 givenname: Seunghee surname: Han fullname: Han, Seunghee organization: Advanced Analysis Center, Korea Institute of Science and Technology, Seoul 136-791, Korea |
BackLink | http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=17775479$$DView record in Pascal Francis |
BookMark | eNqF0F1LIzEUBuAgLljdBX9CbnbxZjRfM0kuS1fbgeouWNgrCWnmZBudyXQnU7X_3ikt7pV4deDw8J7De4qOYxsBoXNKLikh7CoFe8kYJ0doRIkuMq2pOkYjQgXLmGD0BJ2m9EgIUVwVI_RQxmdIffhr-9BG3HocmnXXPkOFbbWCtFsuoX8BiHiywT7UDbaxwuu23oYmVICXW9yvAP--L8vsuhzfjn_iHtwqhn8b-Iq-eFsn-HaYZ2hxc72YzLL5r2k5Gc8zJ5gmWVUAUUqLgnItgWmd59x7yamjuZZ5rklBhLWKSye0I8PjXgJnnjHm7VLwM_RjHzt8PlxNvWlCclDXNkK7SYZpoXQh1OdQyeGqoAO82EPXtSl14M26C43ttoYSs-vZDD2bXc8D_X7ItMnZ2nc2upD-eyllLqQeXLZ3L6GG7Yd55r4cH3IPPqQeXt-97Z5MIbnMzZ-7qZkubvl8xmaG8jf9rZno |
CODEN | SIANDQ |
CitedBy_id | crossref_primary_10_1016_j_surfcoat_2009_12_004 |
Cites_doi | 10.1016/S0042-207X(00)00226-8 10.1116/1.581289 10.1116/1.580842 10.1016/S0042-207X(01)00332-3 10.1063/1.339858 10.1016/0040-6090(95)08142-9 10.1016/S0921-5093(99)00763-7 10.1016/j.surfcoat.2004.07.040 |
ContentType | Journal Article Conference Proceeding |
Copyright | Copyright © 2006 John Wiley & Sons, Ltd. 2006 INIST-CNRS |
Copyright_xml | – notice: Copyright © 2006 John Wiley & Sons, Ltd. – notice: 2006 INIST-CNRS |
DBID | BSCLL IQODW AAYXX CITATION 7SP 7SR 7U5 8BQ 8FD H8G JG9 L7M 7TB FR3 |
DOI | 10.1002/sia.2230 |
DatabaseName | Istex Pascal-Francis CrossRef Electronics & Communications Abstracts Engineered Materials Abstracts Solid State and Superconductivity Abstracts METADEX Technology Research Database Copper Technical Reference Library Materials Research Database Advanced Technologies Database with Aerospace Mechanical & Transportation Engineering Abstracts Engineering Research Database |
DatabaseTitle | CrossRef Materials Research Database Copper Technical Reference Library Engineered Materials Abstracts Technology Research Database Electronics & Communications Abstracts Solid State and Superconductivity Abstracts Advanced Technologies Database with Aerospace METADEX Mechanical & Transportation Engineering Abstracts Engineering Research Database |
DatabaseTitleList | CrossRef Materials Research Database Technology Research Database |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Chemistry Physics |
EISSN | 1096-9918 |
EndPage | 347 |
ExternalDocumentID | 10_1002_sia_2230 17775479 SIA2230 ark_67375_WNG_GTM3LH2H_1 |
Genre | article |
GroupedDBID | -~X .3N .GA .Y3 05W 0R~ 10A 123 1L6 1OB 1OC 1ZS 31~ 33P 3SF 3WU 4.4 4ZD 50Y 50Z 51W 51X 52M 52N 52O 52P 52S 52T 52U 52W 52X 5VS 66C 702 7PT 8-0 8-1 8-3 8-4 8-5 8UM 930 A03 AAESR AAEVG AAHHS AANLZ AAONW AASGY AAXRX AAZKR ABCQN ABCUV ABEFU ABEML ABHUG ABIJN ABJNI ABPVW ACAHQ ACBWZ ACCFJ ACCZN ACGFS ACIWK ACNCT ACPOU ACSCC ACXBN ACXME ACXQS ADAWD ADBBV ADDAD ADEOM ADIZJ ADKYN ADMGS ADOZA ADXAS ADZMN AEEZP AEIGN AEIMD AENEX AEQDE AEUQT AEUYR AFBPY AFFPM AFGKR AFPWT AFVGU AFZJQ AGJLS AHBTC AIURR AIWBW AJBDE AJXKR ALAGY ALMA_UNASSIGNED_HOLDINGS ALUQN AMBMR AMYDB ASPBG ATUGU AUFTA AVWKF AZBYB AZFZN AZVAB BAFTC BDRZF BFHJK BHBCM BMNLL BMXJE BNHUX BROTX BRXPI BSCLL BY8 CS3 D-E D-F DCZOG DPXWK DR1 DR2 DRFUL DRSTM DU5 EBS EJD F00 F01 F04 F5P FEDTE FOJGT G-S G.N GNP GODZA H.T H.X HBH HF~ HHY HHZ HVGLF HZ~ I-F IX1 J0M JPC KQQ LATKE LAW LC2 LC3 LEEKS LH4 LITHE LOXES LP6 LP7 LUTES LW6 LYRES M6K MEWTI MK4 MRFUL MRSTM MSFUL MSSTM MXFUL MXSTM N04 N05 N9A NDZJH NF~ NNB O66 O9- P2P P2W P2X P4D PALCI Q.N Q11 QB0 QRW R.K RIWAO RJQFR RNS ROL RWI RWM RX1 RYL SAMSI SUPJJ TN5 UB1 V2E W8V W99 WBKPD WFSAM WH7 WIB WIH WIK WJL WOHZO WQJ WRC WTY WXSBR WYISQ XG1 XPP XV2 ZZTAW ~02 ~IA ~WT AITYG HGLYW AAPBV IQODW AAYXX CITATION 7SP 7SR 7U5 8BQ 8FD H8G JG9 L7M 7TB FR3 |
ID | FETCH-LOGICAL-c4290-d6e0889461397e299553ff731c15975590604aa837c49c0386f7e32f222fab43 |
IEDL.DBID | DR2 |
ISSN | 0142-2421 |
IngestDate | Fri Aug 16 04:33:28 EDT 2024 Sat Aug 17 03:45:50 EDT 2024 Fri Aug 23 01:52:22 EDT 2024 Sun Oct 22 16:09:05 EDT 2023 Sat Aug 24 00:54:51 EDT 2024 Wed Jan 17 05:01:57 EST 2024 |
IsDoiOpenAccess | false |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 4 |
Keywords | polyimide Ion sources deposition plasma source ion implantation Adhesion Plasma sources AES |
Language | English |
License | CC BY 4.0 |
LinkModel | DirectLink |
MeetingName | Papers presented at ECASIA'05: Proceedings of the 11th European Conference on Applications of Surface and Interface Analysis, 25-30 September 2005, Vienna, Austria |
MergedId | FETCHMERGED-LOGICAL-c4290-d6e0889461397e299553ff731c15975590604aa837c49c0386f7e32f222fab43 |
Notes | ArticleID:SIA2230 ark:/67375/WNG-GTM3LH2H-1 istex:307DA11E9184F302A93E6B070548F9427DCCAE3C SourceType-Scholarly Journals-2 ObjectType-Feature-2 ObjectType-Conference Paper-1 content type line 23 SourceType-Conference Papers & Proceedings-1 ObjectType-Article-3 |
OpenAccessLink | https://onlinelibrary.wiley.com/doi/pdfdirect/10.1002/sia.2230 |
PQID | 28773141 |
PQPubID | 23500 |
PageCount | 5 |
ParticipantIDs | proquest_miscellaneous_29489648 proquest_miscellaneous_28773141 crossref_primary_10_1002_sia_2230 pascalfrancis_primary_17775479 wiley_primary_10_1002_sia_2230_SIA2230 istex_primary_ark_67375_WNG_GTM3LH2H_1 |
PublicationCentury | 2000 |
PublicationDate | April 2006 |
PublicationDateYYYYMMDD | 2006-04-01 |
PublicationDate_xml | – month: 04 year: 2006 text: April 2006 |
PublicationDecade | 2000 |
PublicationPlace | Chichester, UK |
PublicationPlace_xml | – name: Chichester, UK – name: Chichester |
PublicationTitle | Surface and interface analysis |
PublicationTitleAlternate | Surf. Interface Anal |
PublicationYear | 2006 |
Publisher | John Wiley & Sons, Ltd Wiley |
Publisher_xml | – name: John Wiley & Sons, Ltd – name: Wiley |
References | Ramos MMD. Vacuum 2002; 64: 255. Mittal KL. Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications. VSP: The Netherlands, 2001. Soane DS, Martynenko Z. Polymers in Electronics: Fundamentals and Applications. Elsevier: Amsterdam, 1989. Lei MK, Chen JD, Wang Y, Zhang ZL. Vacuum 2000; 57: 327. Milde F, Goedicke K, Fahland M. Thin Solid Films 1996; 279: 169. Anders A. Handbook of Plasma Immersion Ion Implantation and Deposition. Wiley: New York, 2000. Conrad JR. J. Appl. Phys. 1987; 62: 777. Malik SM, Fetherston RP, Conrad JR. J. Vac. Sci. Technol., A 1997; 15: 2875. Lee YH, Han SH, Lee JH, Yoon JH, Lim HE, Kim KJ. J. Vac. Sci. Technol., A 1998; 16: 1710. Park IS, Ahn EC, Yu J, Lee HY. Mater. Sci. Eng., A 2000; 282: 137. Li G, Liu C, Li J, Zhang C, Mu Z, Long Z. Surf. Coat. Technol. 2004; 193: 112. 1998; 16 2000; 282 1994 1987; 62 2001 2002; 64 1996; 279 2000 2000; 57 1997; 15 1989 2004; 193 e_1_2_1_7_2 e_1_2_1_5_2 e_1_2_1_2_2 e_1_2_1_11_2 Garbassi F (e_1_2_1_6_2) 1994 Anders A (e_1_2_1_10_2) 2000 e_1_2_1_12_2 Soane DS (e_1_2_1_3_2) 1989 e_1_2_1_13_2 Mittal KL (e_1_2_1_4_2) 2001 e_1_2_1_8_2 e_1_2_1_9_2 |
References_xml | – volume: 279 start-page: 169 year: 1996 publication-title: Thin Solid Films – year: 2000 – volume: 16 start-page: 1710 year: 1998 publication-title: J. Vac. Sci. Technol., A – volume: 62 start-page: 777 year: 1987 publication-title: J. Appl. Phys. – volume: 64 start-page: 255 year: 2002 publication-title: Vacuum – volume: 57 start-page: 327 year: 2000 publication-title: Vacuum – volume: 193 start-page: 112 year: 2004 publication-title: Surf. Coat. Technol. – year: 1994 – year: 2001 – volume: 282 start-page: 137 year: 2000 publication-title: Mater. Sci. Eng., A – year: 1989 – volume: 15 start-page: 2875 year: 1997 publication-title: J. Vac. Sci. Technol., A – ident: e_1_2_1_8_2 doi: 10.1016/S0042-207X(00)00226-8 – volume-title: Polymers in Electronics: Fundamentals and Applications year: 1989 ident: e_1_2_1_3_2 contributor: fullname: Soane DS – ident: e_1_2_1_13_2 doi: 10.1116/1.581289 – ident: e_1_2_1_12_2 doi: 10.1116/1.580842 – ident: e_1_2_1_2_2 doi: 10.1016/S0042-207X(01)00332-3 – volume-title: Polymer Surfaces year: 1994 ident: e_1_2_1_6_2 contributor: fullname: Garbassi F – ident: e_1_2_1_11_2 doi: 10.1063/1.339858 – ident: e_1_2_1_7_2 doi: 10.1016/0040-6090(95)08142-9 – volume-title: Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications year: 2001 ident: e_1_2_1_4_2 contributor: fullname: Mittal KL – ident: e_1_2_1_5_2 doi: 10.1016/S0921-5093(99)00763-7 – ident: e_1_2_1_9_2 doi: 10.1016/j.surfcoat.2004.07.040 – volume-title: Handbook of Plasma Immersion Ion Implantation and Deposition year: 2000 ident: e_1_2_1_10_2 contributor: fullname: Anders A |
SSID | ssj0008386 |
Score | 1.783793 |
Snippet | Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of materials. In... Abstract Plasma source ion implantation (PSII) is a relatively simple and effective ion implantation/deposition technique for the surface modification of... |
SourceID | proquest crossref pascalfrancis wiley istex |
SourceType | Aggregation Database Index Database Publisher |
StartPage | 343 |
SubjectTerms | adhesion AES Condensed matter: electronic structure, electrical, magnetic, and optical properties Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science; rheology deposition Exact sciences and technology Physics plasma source ion implantation polyimide |
Title | Investigation of improved adhesion between Cu film and polyimide by the PSII-EIAMAD technique |
URI | https://api.istex.fr/ark:/67375/WNG-GTM3LH2H-1/fulltext.pdf https://onlinelibrary.wiley.com/doi/abs/10.1002%2Fsia.2230 https://search.proquest.com/docview/28773141 https://search.proquest.com/docview/29489648 |
Volume | 38 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1fT9swED9NoGl7GYNtorCBkSbeWpLYbZpHVP60E6AJOg1pD5bt2FoEJIi0EvC0j8Bn5JNw5zQtnbRp2lNe7Mi-s32_O59_B_BZBFwZ7ujZr9ZNERrcUjE6rkooYh-nyxx6jXx80ul_E1_O2-eTrEp6C1PxQ0wDbrQz_HlNG1zpcmdGGlpmqoW2jdx14tEjPHQ6Y47qcl_kER2AyN961ryzQbRTd5yzRIsk1FvKjFQlCsdVVS3mYOdz8Oqtz8ES_KjHXSWdXLTGI90y979ROv7fxN7CmwkoZbvVKlqGFzZfgVe9uhbcCrz0iaKmfAfyGTFHkbPCscyHJWzKVPrTUuyNTXK_WG_MXHZ5xVSesuvi8i67ylLL9B1D0Mm-ng0Gj78e9gd46u-xKZXsexge7A97_eakSEPToCkLmmnHUqaU6BCUtGjc2m3uXMxDg0ApRn-F2HmUQj_YiMQEqBYXWx45xCVOacE_wEJe5HYVmFbG6NA57NHFlWIS55wKrLNRHGrFTQO2an3J64qKQ1aky5FEmUmSWQO2vSKnDdTNBaWuxW35_eRQHg6P-VE_6suwARtzmp79MSZOwDhpwGateonCpmsUldtiXEr0MXF6IvxLi0R0k47o4mi8ov84XHk22KXv2r82XIfXVQyIUoc-wsLoZmw_ISoa6Q2__p8ANn8INw |
link.rule.ids | 310,311,315,786,790,795,796,1382,23958,23959,25170,27957,27958,46329,46753 |
linkProvider | Wiley-Blackwell |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1fb9MwED9Nm9B44c8AUf5sRkK8tUtip2m0p6lsS6CtECtiD0iW49gi2pZMayttPO0j7DPySbhzmnZFAiGe8mJH9p3P97vz-WeAt8LjSnNL136zrC18jSYVYeCqhCL2cTrModvIw1E3-SI-nIQna7DX3IWp-SEWCTeyDLdfk4FTQnp3yRo6KVQHnRvG6xto7aGLpz4vuaN63D3ziCFA4M49G-ZZL9hteq74og0S6xXVRqoJisfW71qsAM-78NX5n8OH8K0ZeV12ctqZTbOO_vEbqeN_Tu0RPJjjUrZfL6THsGbKLdjsN8_BbcE9VyuqJ09A3uHmqEpWWVa4zITJmcq_G0q_sXn5F-vPmC3Ozpkqc3ZRnV0X50VuWHbNEHeyT8dp-vPm9iDFjf89W7DJPoXx4cG4n7Tn7zS0NXozr513DRVLiS6hSYP-LQy5tRH3NWKlCEMWIuhRCkNhLWLtoV5sZHhgEZpYlQn-DNbLqjTPgWVK68y3Fnv0cLHo2FqrPGNNEPmZ4roFbxqFyYuajUPWvMuBRJlJklkL3jlNLhqoy1OqXotC-XV0JI_GQz5IgkT6LdheUfXyjxHRAkZxC3Ya3UsUNp2kqNJUs4nEMBOnJ_y_tIhFL-6KHo7GafqPw5XH6T59X_xrwx3YTMbDgRyko48v4X6dEqJKolewPr2cmdcIkqbZtjOGX7yxDFk |
linkToPdf | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1fb9MwED-hTfx52WCA6BibkRBv7ZLYTZrHqV3XwFZNrIhJPFi2Y4toW1KtrcR44iPsM-6TcJc07YoEQjzlxY7sO5_vzv75dwDvhMeV4Y6e_WrdFL5Bk4owcVVCEfs4XebQa-STYTj4LD6ct8_nqEp6C1PxQywO3Mgyyv2aDHycuv0laegkUy30bZiur4uQB7Sie5-W1FEdXlZ5xAwgKK89a-JZL9ive664onWS6neCRqoJSsdVZS1W4s770Wvpfvqb8LUeeIU6uWjNprplfvzG6fh_M3sKG_OolB1Uy-gZPLD5Fjzu1sXgtuBhiRQ1k-cg7zFzFDkrHMvKcwmbMpV-s3T4xubgL9adMZddXjGVp2xcXN5kV1lqmb5hGHWy07Mkuft5e5jgtt9jCy7ZFzDqH466g-a8SkPToC_zmmloCSolQoolLXq3dps7F3HfYKQUYcJC9DxKYSJsRGw8VIuLLA8cBiZOacFfwlpe5PYVMK2M0b5z2KODS8XEzjnlWWeDyNeKmwa8rfUlxxUXh6xYlwOJMpMkswa8LxW5aKCuLwi7FrXll-GRPBqd8ONBMJB-A3ZXNL38Y0SkgFHcgL1a9RKFTfcoKrfFbCIxycTpCf8vLWLRiUPRwdGUiv7jcOVZckDf7X9tuAePTnt9eZwMP76GJ9V5EMGIdmBtej2zbzBCmurd0hR-AZXQCwg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=proceeding&rft.title=Surface+and+interface+analysis&rft.atitle=Investigation+of+improved+adhesion+between+Cu+film+and+polyimide+by+the+PSII-EIAMAD+technique&rft.au=LEE%2C+Yeonhee&rft.au=JU+HI+HONG&rft.au=CHUN%2C+Hyejin&rft.au=HAN%2C+Seunghee&rft.date=2006-04-01&rft.pub=Wiley&rft.issn=0142-2421&rft.eissn=1096-9918&rft.volume=38&rft.issue=4&rft.spage=343&rft.epage=347&rft_id=info:doi/10.1002%2Fsia.2230&rft.externalDBID=n%2Fa&rft.externalDocID=17775479 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0142-2421&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0142-2421&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0142-2421&client=summon |