Reaction forming of joints in silicon carbide ceramic materials

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 483; pp. 747 - 750
• Main Authors: Li, Shi-Bin, Ma, Ming-Liang, Gao, Ji-Qiang, Jin, Zhi-Hao
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 15.06.2008; Elsevier
• Subjects: Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Exact sciences and technology; Fatigue, brittleness, fracture, and cracks; Joints; Materials science; Materials synthesis; materials processing; Mechanical and acoustical properties of condensed matter; Mechanical properties; Mechanical properties of solids; Physics; Reaction forming; Silicon carbide; Reaction forming; Mechanical properties; Silicon carbide; Joints; Interfacial layer; Scanning electron microscopy; Electrical conductivity; Ruptures; Recrystallization; Flexural strength; Interface reaction; Microstructure; Formation mechanism; Fracture mode; Diffusion welding
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2006.12.181

Joints between reaction-bonded and recrystallized silicon carbide materials have been obtained using a reaction-forming approach. The formation mechanism of these reaction-bonded joints was analyzed and the microstructure of the joint areas, as well as the fracture morphology, was observed by optical and scanning electron microscopy. The mechanical and electrical properties of the joints were also measured. This study suggests that a good contact interlayer is formed between joints and the parent materials. The flexural strength and the electrical resistivity of the silicon or silicon carbide parent materials are not significantly affected by the reaction-forming process. The latter provides a way for optimizing the microstructure and composition of joint layers and obtaining high performance joints.