Pb electrodeposition on polycrystalline Cu in the presence and absence of Cl −: A combined oblique incidence reflectivity difference and in situ AFM study

Oblique incidence reflectivity difference (OI-RD) measurements reveal differences in the earliest stages of overpotential-deposited (OPD) growth between Pb electrodeposition on polycrystalline Cu surfaces in the presence and absence of Cl −. At moderate overpotentials, when only 100 mM ClO 4 - is pr...

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Published inSurface science Vol. 601; no. 8; pp. 1886 - 1891
Main Authors Wu, Guang Yu, Bae, S.-E., Gewirth, A.A., Gray, J., Zhu, X.D., Moffat, T.P., Schwarzacher, W.
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 01.04.2007
Amsterdam Elsevier Science
New York, NY
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Summary:Oblique incidence reflectivity difference (OI-RD) measurements reveal differences in the earliest stages of overpotential-deposited (OPD) growth between Pb electrodeposition on polycrystalline Cu surfaces in the presence and absence of Cl −. At moderate overpotentials, when only 100 mM ClO 4 - is present, the magnitude of the real part of the OI-RD signal continues to increase after completion of the first underpotential-deposited (UPD) Pb monolayer, but with the addition of 20 mM KCl the magnitude decreases after the UPD monolayer forms. In situ atomic force microscopy (AFM) shows that in the former case the island density is much greater than in the latter. Using OI-RD as a probe, we show additionally that when the substrate potential is returned to a more positive potential in the presence of Cl −, the UPD Pb monolayer dissolves after the Pb islands disappear.
Bibliography:ObjectType-Article-2
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content type line 23
ISSN:0039-6028
1879-2758
DOI:10.1016/j.susc.2007.02.016