Copper phenyl phosphonate for epoxy resin and cyanate ester copolymer with improved flame retardancy and thermal properties

• Published in: e-Polymers Vol. 23; no. 1; pp. 1473 - 81
• Main Authors: Cao, Zhilin, Ren, Changxin, Wang, Zhengzhou
• Format: Journal Article
• Language: English
• Published: Berlin De Gruyter 23.05.2023; Walter de Gruyter GmbH
• Subjects: Chemical synthesis; Civil engineering; Copolymers; Copper; copper phenyl phosphonate; Curing; cyanate ester; Cyanates; Dielectric properties; Enthalpy; epoxy resin; Epoxy resins; flame retardant; Flame retardants; Flammability; Glass transition temperature; Heat release rate; Heat resistance; High temperature; Materials science; Phenyl phosphonate; Phosphonates; Phosphonic acids; Phosphorus; Polymers; thermal properties; Thermal resistance; Thermodynamic properties
• ISSN: 1618-7229; 2197-4586; 1618-7229
• DOI: 10.1515/epoly-2023-0004

Epoxy resin (EP)/cyanate ester (CE) copolymer, an important structural material with high temperature resistance and low dielectric constant in aerospace, microelectronics, and related fields, is still of great flammability danger. In this work, copper phenyl phosphonate (CuPP), a flame retardant used in EP/CE copolymer was synthesized by the reaction of phenyl phosphonic acid and copper nitrate trihydrate. The fire and thermal behavior of EP/CE/CuPP composites were studied in detail. The results suggested that the UL-94 rating and limiting oxygen index of EP/CE composite with 5 wt% CuPP (EP/CE/CuPP5) reach V-1 level and 30.6%, respectively. Compared with pure EP/CE copolymer, the peak heat release rate and total heat release values of EP/CE/CuPP5 decreased by 34.5% and 18.9%, respectively. The glass transition temperature of EP/CE/CuPP composite is higher than that of pure EP/CE copolymer, suggesting that the fire-retardant composite has higher work temperature and better heat resistance.