Modeling of Mechanical Behavior of Microcantilever due to Intrinsic Strain during Deposition

• Published in: Journal of mechanical science and technology Vol. 20; no. 10; pp. 1646 - 1652
• Main Authors: KIM, Sang-Hyun, MANI, Sathyanarayanan, BOYD, James G
• Format: Journal Article
• Language: English
• Published: Seoul 대한기계학회 01.10.2006; Korean Society of Mechanical Engineers; Springer Nature B.V
• Subjects: Cantilever beams; Cross-disciplinary physics: materials science; rheology; Deflection; Deposition; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Materials science; Mathematical analysis; Mathematical models; Mechanical instruments, equipment and techniques; Mechanical properties; Methods of deposition of films and coatings; film growth and epitaxy; Micromechanical devices and systems; Ordinary differential equations; Physics; Residual stress; Strain; Studies; 기계공학; Residual Stress; Multilayer Microcantilever; Beam Deflection; Deposition; Intrinsic Strain; Stress analysis; Elastic constants; Deformation modulus; Residual stresses; Real time; Layer thickness; Cantilever beam; Deposition process; Stress distribution; Modelling; Microelectromechanical device
• ISSN: 1738-494X; 1976-3824
• DOI: 10.1007/BF02916268

A model of mechanical behavior of microcantilever due to intrinsic strain during deposition of MEMS structures is derived. A linear ordinary differential equation is derived for the beam deflection as a function of the thickness of the deposited layer. Closed-form solutions are not possible, but numerical solutions are plotted for various dimensionless ratios of the beam stiffness, the intrinsic strain, and the elastic moduli of the substrate and deposited layer. This model predicts the deflection of the cantilever as a function of the deposited layer thickness and the residual stress distribution during deposition. The usefulness of these equations is that they are indicative of the real time behavior of the structures, i.e. it predicts the deflection of the beam continuously during deposition process.[PUBLICATION ABSTRACT]