Fabrication of top-down gold nanostructures using a damascene process

• Published in: Microelectronic engineering Vol. 177; pp. 41 - 45
• Main Authors: Merhej, Mouawad, Drouin, Dominique, Salem, Bassem, Baron, Thierry, Ecoffey, Serge
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 05.06.2017; Elsevier BV; Elsevier
• Subjects: Atomic force microscopy; Chemical mechanical planarization; Chemical-mechanical polishing; Damascene; Engineering Sciences; Gold; Material removal rate (machining); Micro-nano-structures; Microscopy; Microstructure; Removal rate; Selectivity; Silica; Silicon dioxide; Slurries; Gold; Removal rate; Micro-nano-structures; Chemical mechanical planarization; Damascene
• ISSN: 0167-9317; 1873-5568
• DOI: 10.1016/j.mee.2017.02.005

In this work, we propose a damascene process to fabricate embedded gold micro- and nano-structures at the same time. We present a systematic study of the material removal rate (MRR) and the selectivity on both gold and silicon dioxide. The embedded microstructures are 2μm wide and 60nm deep, while the nanostructures widths vary from 70nm to 500nm for a 50nm depth. Moreover, we highlight the contribution of the CMP in polishing the surfaces of gold films. Morphological characterizations are performed using mechanical profilometry, Atomic Force Microscopy (AFM), and Scanning Electron Microscopy (SEM). MRR and selectivity are evaluated as a function of time, applied pressure, platen rotation speed, and slurry flow. [Display omitted] •A damascene process to fabricate embedded gold micro-and nano-structures at the same time.•Study of the material removal rate (MRR) and the selectivity on both gold and SiO2 as function of different CMP parameters.•Effect of CMP on gold surface roughness.