Characterization of polymer matrix and low melting point solder for anisotropic conductive film

The chemo-rheological mechanisms of a polymer matrix and a low melting point solder for an anisotropic conductive film (ACF) have been characterized. For the material characterization of the polymer matrix and solder, a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA)...

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Bibliographic Details
Published inMicroelectronic engineering Vol. 85; no. 2; pp. 327 - 331
Main Authors Eom, Yong-Sung, Baek, Ji-Won, Moon, Jong-Tae, Nam, Jae-Do, Kim, Jong-Min
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.02.2008
Elsevier Science
Subjects
Anisotropic conductive film
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
High reliability
Integrated circuits
Low melting point solder
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Anisotropic conductive film
High reliability
Low melting point solder
Differential scanning calorimetry
High performance
Oxide layer
Polymer
Integrated circuit bonding
Hardening
Interconnection
Soldered joint
Integrated circuit
Reaction time
Reliability
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Summary:The chemo-rheological mechanisms of a polymer matrix and a low melting point solder for an anisotropic conductive film (ACF) have been characterized. For the material characterization of the polymer matrix and solder, a differential scanning calorimetry (DSC) and a dynamic mechanical analyzer (DMA) experiments were conducted. The conversion and viscosity of the polymer matrix was observed by DSC and DMA, respectively. In order to control the curing conditions such as the reaction temperature and time of polymer matrix, the adequate amount of catalyst was used. The compatibility between the viscosity of a polymer matrix and a melting temperature of solder was characterized to optimize the processing cycle. The reductant was also added to remove the oxide layer performed on the surface of solder in the air environment. Based on these chemo-rheological phenomena of the polymer matrix and solder, the optimum polymer system and its processing cycle were designed for the high performance and reliability in the electrical interconnection system.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2007.07.005