Determination of Mechanical Properties of Copper at the Micron Scale

Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test struc...

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Bibliographic Details
Published inAdvanced engineering materials Vol. 8; no. 11; pp. 1119 - 1125
Main Authors Kiener, D., Motz, C., Schöberl, T., Jenko, M., Dehm, G.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag 01.11.2006
WILEY‐VCH Verlag
Subjects
Auger electron spectroscopy
Copper
Mechanical properties
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Summary:Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test structures. Conventional strain gradient plasticity approaches are not capable of explaining this behaviour. The surface damage introduced by Ga+ ion implantation during focused ion beam preparation was investigated using Auger electron spectroscopy and its consequence on the mechanical response of the miniaturized test samples is addressed.
Bibliography:ArticleID:ADEM200600129
CM gratefully acknowledges financial support by the Austrian Fonds zur Förderung der wissenschaftlichen Forschung, Project P17375-N07. DK acknowledges support within the framework of the K-plus competence centre program. The authors thank M. Pečar for support with the AES analysis and Prof. Dr. R. Pippan for valuable discussions.
Austrian Fonds zur Förderung der wissenschaftlichen Forschung - No. P17375-N07
ark:/67375/WNG-BZG1PJB4-F
istex:5F3ADEF0771EA4B501B18A68405D7BAFDFF0B119
CM gratefully acknowledges financial support by the Austrian Fonds zur Förderung der wissenschaftlichen Forschung, Project P17375‐N07. DK acknowledges support within the framework of the K‐plus competence centre program. The authors thank M. Pečar for support with the AES analysis and Prof. Dr. R. Pippan for valuable discussions.
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ISSN:1438-1656
1527-2648
DOI:10.1002/adem.200600129