Current-assisted direct Cu/Cu joining

Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240–300°C for 10–50min under 40MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region...

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Bibliographic Details
Published inScripta materialia Vol. 104; pp. 21 - 24
Main Authors Shin, Chanho, Ma, Sung Woo, Lee, Jeong Hwan, Kim, Ki Bum, Suh, Minsuk, Kim, Namseog, Kim, Young-Ho
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 15.07.2015
Subjects
Contact resistance
Copper
Cu/Cu direct
Electromigration
Enhanced diffusion
Fracture mechanics
Joining
Joule heating
Wire
Electromigration
Cu/Cu direct
Joining
Joule heating
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Summary:Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240–300°C for 10–50min under 40MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
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ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2015.03.016