Experimental–numerical hybrid stress analysis for a curving crack in a thin glass plate under thermal load

• Published in: Engineering fracture mechanics Vol. 131; pp. 514 - 524
• Main Authors: Yoneyama, S., Sakaue, K.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.11.2014
• Subjects: Compressive properties; Crack; Crack propagation; Experimental stress analysis; Fracture mechanics; Glass; Hybrid method; Phase-stepping method; Photoelasticity; Stress concentration; Stress distribution; Stress intensity factor; Stresses; T-stress; Tensile stress; Phase-stepping method; Hybrid method; Fracture mechanics; Stress intensity factor; Photoelasticity; T-stress; Experimental stress analysis; Crack
• ISSN: 0013-7944; 1873-7315
• DOI: 10.1016/j.engfracmech.2014.09.007

•Stress fields around a curving crack in a thin glass plate is measured using instantaneous phase-stepping photoelasticity.•An experimental–numerical hybrid method is applied to the analysis of stress field at the crack tip.•Mode II stress intensity factor exhibits nonzero value although the crack growth smoothly.•Compressive stresses are distributed surrounding the tensile stresses at the crack tip.•The compressive stress field leads to both higher stress intensity factor and crack oscillation. The stress fields around an oscillating crack tip in a thin plate are studied using an experimental–numerical hybrid method. Instantaneous phase-stepping photoelasticity using a CCD camera equipped with a pixelated microretarder array is used for measuring the stress fields around a propagating crack tip. Not only the principal direction but also the principal stress difference around a growing crack is obtained. Then, the stress distributions around a crack are evaluated by the experimental–numerical hybrid method. Results show that the proposed hybrid method is effective for the study of crack growth behavior in the glass plate. The results obtained in this study show that the compressive stresses exist around the tensile stress region at the crack tip. It can be considered that the existence of the compressive stress distribution surrounding the tensile stress field at the crack tip leads to both the high value of the stress intensity factor and the crack oscillation.