Notch effect on creep–fatigue life for Sn–3.5Ag solder

• Published in: Engineering fracture mechanics Vol. 78; no. 8; pp. 1794 - 1807
• Main Authors: Nozaki, Mineo, Zhang, Shengde, Sakane, Masao, Kobayashi, Kaoru
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.05.2011
• Subjects: Circumferential notched specimen; Crack initiation; Creep–fatigue; Failure; Finite element analysis; Finite element method; Fracture mechanics; Notches; Roots; Solder; Solders; Strain; von Mises equivalent strain; Solder; Circumferential notched specimen; Finite element analysis; von Mises equivalent strain; Creep–fatigue
• ISSN: 0013-7944; 1873-7315
• DOI: 10.1016/j.engfracmech.2011.02.001

This paper studies the creep–fatigue crack initiation and failure lives of Sn–3.5Ag solder notched specimens focused on the multiaxial strain at the notch root. Push–pull creep–fatigue tests were performed using three circumferential notched specimens using four kinds of creep–fatigue strain waveforms. Multiaxial strains at the notched section were calculated by finite element (FE) analysis under four kinds of creep–fatigue loading. Creep–fatigue damage laws were applied for evaluating the crack initiation and failure lives using the multiaxial strains obtained by the FE analysis. von Mises equivalent strain at the notch root estimated the crack initiation lives with a large scatter as well as the failure lives. Instead, the mean value of von Mises equivalent strain over the cross section of the notch root estimated the crack initiation and failure lives with a small scatter.