High performance low temperature polycrystalline Si thin-film transistors fabricated by silicide seed-induced lateral crystallization
A novel and simple crystallization method for high performance polycrystalline silicon (poly-Si) thin-film transistors (TFTs) using Ni silicide seed-induced lateral crystallization (SILC) was proposed in this study, and it includes no additional deposition and/or etching processes that are not found...
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Published in | Electronic materials letters Vol. 8; no. 3; pp. 251 - 258 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Dordrecht
Springer Netherlands
01.06.2012
대한금속·재료학회 |
Subjects | |
Online Access | Get full text |
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Summary: | A novel and simple crystallization method for high performance polycrystalline silicon (poly-Si) thin-film transistors (TFTs) using Ni silicide seed-induced lateral crystallization (SILC) was proposed in this study, and it includes no additional deposition and/or etching processes that are not found in the fabrication of conventional metal-induced lateral crystallization (MILC) TFTs. The poly-Si thin films crystallized by SILC were characterized by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), and Micro-Raman spectroscopy. The electrical properties were obtained from
I
D
-
V
G
transfer curves and the interface trap density was determined by Levinson plot analysis. The results show that SILC poly-Si films have lower Ni contamination, better crystallinity, and higher crystalline fraction than MILC poly-Si films. The p-channel SILC poly-Si TFTs exhibited a mobility of 66 cm
2
/V·s, a minimum leakage current of 3.4 × 10
−11
A at
V
D
= −5 V, a subthreshold slope of 0.85 V/dec, and a maximum on/off ratio of 5.0 × 10
6
, all of which resulted in a high-performance device which surpassed conventional MILC poly-Si TFTs. |
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Bibliography: | G704-SER000000579.2012.8.3.017 |
ISSN: | 1738-8090 2093-6788 |
DOI: | 10.1007/s13391-012-2079-x |