High performance low temperature polycrystalline Si thin-film transistors fabricated by silicide seed-induced lateral crystallization

A novel and simple crystallization method for high performance polycrystalline silicon (poly-Si) thin-film transistors (TFTs) using Ni silicide seed-induced lateral crystallization (SILC) was proposed in this study, and it includes no additional deposition and/or etching processes that are not found...

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Bibliographic Details
Published inElectronic materials letters Vol. 8; no. 3; pp. 251 - 258
Main Authors Byun, Chang Woo, Son, Se Wan, Lee, Yong Woo, Joo, Seung Ki
Format Journal Article
LanguageEnglish
Published Dordrecht Springer Netherlands 01.06.2012
대한금속·재료학회
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Summary:A novel and simple crystallization method for high performance polycrystalline silicon (poly-Si) thin-film transistors (TFTs) using Ni silicide seed-induced lateral crystallization (SILC) was proposed in this study, and it includes no additional deposition and/or etching processes that are not found in the fabrication of conventional metal-induced lateral crystallization (MILC) TFTs. The poly-Si thin films crystallized by SILC were characterized by x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), and Micro-Raman spectroscopy. The electrical properties were obtained from I D - V G transfer curves and the interface trap density was determined by Levinson plot analysis. The results show that SILC poly-Si films have lower Ni contamination, better crystallinity, and higher crystalline fraction than MILC poly-Si films. The p-channel SILC poly-Si TFTs exhibited a mobility of 66 cm 2 /V·s, a minimum leakage current of 3.4 × 10 −11 A at V D = −5 V, a subthreshold slope of 0.85 V/dec, and a maximum on/off ratio of 5.0 × 10 6 , all of which resulted in a high-performance device which surpassed conventional MILC poly-Si TFTs.
Bibliography:G704-SER000000579.2012.8.3.017
ISSN:1738-8090
2093-6788
DOI:10.1007/s13391-012-2079-x