Ultralow-k Dielectrics Made by Supercritical Foaming of Thin Polymer Films

Ultralow dielectric constants have been achieved for thin porous films of high‐Tg polymers. Rapid solid‐state polymer expansion applying supercritical carbon dioxide was used to create nanosized cavities in thin films of aromatic polyimides (see Figure). Foamed films with spherical voids less than 1...

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Published inAdvanced materials (Weinheim) Vol. 14; no. 15; pp. 1041 - 1046
Main Authors Krause, B., Koops, G.-H., van der Vegt, N.F.A., Wessling, M., Wübbenhorst, M., van Turnhout, J.
Format Journal Article
LanguageEnglish
Published Weinheim WILEY-VCH Verlag 05.08.2002
WILEY‐VCH Verlag
Subjects
Dielectric constant ultralow
Supercritical foaming
Thin films polymer
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Summary:Ultralow dielectric constants have been achieved for thin porous films of high‐Tg polymers. Rapid solid‐state polymer expansion applying supercritical carbon dioxide was used to create nanosized cavities in thin films of aromatic polyimides (see Figure). Foamed films with spherical voids less than 10 nm in size as well as multilayered microstructures with interlayer distances of less than 20 nm were made with k values as low as 1.77.
Bibliography:ark:/67375/WNG-LQQX86CJ-T
istex:8314405D21398FEC63D3A4FA1DCA5A1642DBDC47
ArticleID:ADMA1041
ISSN:0935-9648
1521-4095
DOI:10.1002/1521-4095(20020805)14:15<1041::AID-ADMA1041>3.0.CO;2-A