Optimization Method for Double-sided Polishing Process based on Kinematical Analysis

To achieve high surface flatness of silicon wafer in double-sided polishing (DSP) process, kinematical model of DSP process utilizing accurate friction coefficient between wafer and polishing pad was investigated. On the basis of the proposed analytical model, optimization method of a set of rotatio...

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Bibliographic Details
Published inProcedia CIRP Vol. 41; pp. 870 - 874
Main Authors Satake, Urara, Enomoto, Toshiyuki, Fujii, Keitaro, Hirose, Kenji
Format Journal Article
LanguageEnglish
Published Elsevier B.V 2016
Subjects
Flatness
Polishing
Silicon wafer
Polishing
Silicon wafer
Flatness
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Summary:To achieve high surface flatness of silicon wafer in double-sided polishing (DSP) process, kinematical model of DSP process utilizing accurate friction coefficient between wafer and polishing pad was investigated. On the basis of the proposed analytical model, optimization method of a set of rotation conditions of upper/lower platens and inner/outer gears was developed. Optimizations for two types of DSP processes were performed as case study and those results confirmed that the developed optimization method was effective in obtaining the appropriate rotation conditions for achieving high surface flatness of wafer while decreasing the motor load of platens and gears.
ISSN:2212-8271
2212-8271
DOI:10.1016/j.procir.2015.12.043