Indium gallium arsenide microwave power transistors

Depletion-mode InGaAs microwave power MISFETs with 1- mu m gate lengths and up to 1-mm gate widths have been fabricated using an ion-implanted process. The devices employed a plasma-deposited silicon/silicon dioxide gate insulator. The DC current-voltage (I-V) characteristics and RF power performanc...

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Published inIEEE transactions on microwave theory and techniques Vol. 39; no. 7; pp. 1069 - 1075
Main Authors Johnson, G.A., Kapoor, V.J., Shokrani, M., Messick, L.J., Nguyen, R., Stall, R.A., McKee, M.A.
Format Journal Article
LanguageEnglish
Published Legacy CDMS IEEE 01.07.1991
Institute of Electrical and Electronics Engineers
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Summary:Depletion-mode InGaAs microwave power MISFETs with 1- mu m gate lengths and up to 1-mm gate widths have been fabricated using an ion-implanted process. The devices employed a plasma-deposited silicon/silicon dioxide gate insulator. The DC current-voltage (I-V) characteristics and RF power performance at 9.7 GHz are presented. The output power, power-added efficiency, and power gain as a function of input power are reported. An output power of 1.07 W at 9.7 GHz with a corresponding power gain and power-added efficiency of 4.3 dB and 38%, respectively, was obtained. The large-gate-width devices provided over twice the previously reported output power for InGaAs MISFETs at X-band. In addition, the first report of RF output stability of InGaAs MISFETs over 24 h period is also presented. An output power stability within 1.2% over 24 h of continuous operation was achieved. In addition, a drain current drift of 4% over 10/sup 4/ s was obtained.< >
Bibliography:CDMS
Legacy CDMS
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9480
1557-9670
DOI:10.1109/22.85371