Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30°C, 200rpm and 5% pulp den...
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Published in | Hydrometallurgy Vol. 169; pp. 26 - 30 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
01.05.2017
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Subjects | |
Online Access | Get full text |
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Summary: | A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30°C, 200rpm and 5% pulp density. The addition of distilled water precipitated the resin from methyl ethyl ketone. The recovered resin was confirmed to be epoxy resin by FT-IR analysis. Ammonia leaching followed by hydrochloric acid leaching was performed to separate Cu, Sn, Bi sequentially from metal powder. Copper was solubilized easily with leaching efficiency reaching 100% within 15min under the following conditions: 5M NH3 solution, 1M (NH4)2CO3, 0.1M CuCO3, 50°C, and 1% pulp density. Tin and bismuth were recovered as leach residue in the ammonia leaching. Tin was selectively leached in 0.5M HCl solution with 10,000mg/L Sn4+ and 1% pulp density at 50°C and 400rpm, while Bi was not detected in the leach solution. The recycling process has successfully separated Sn, Cu, Bi and resin.
•A solder-paste recycling process was proposed to separate resin, Sn, Bi & Cu, respectively, by swelling & leaching processes•Epoxy resin could be recovered by swelling with methyl ethyl ketone followed by distilled water addition•Cu can be dissolved by ammonia leaching leaving Sn & Bi as leach residue from metal powder obtained from the swelling process•Sn could be selectively leached from Sn and Bi powder using HCl solution with SnCl4. |
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ISSN: | 0304-386X 1879-1158 |
DOI: | 10.1016/j.hydromet.2016.12.004 |