Real-Time Device-Level Transient Electrothermal Model for Modular Multilevel Converter on FPGA
Real-time simulation of modular multilevel converters (MMCs) is challenging due to their complex structure consisting of a large number of submodules (SMs). In the literature, the computational speed is emphasized for MMC modeling in real-time simulation, while accurate and detailed information of i...
Saved in:
Published in | IEEE transactions on power electronics Vol. 31; no. 9; pp. 6155 - 6168 |
---|---|
Main Authors | , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.09.2016
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Real-time simulation of modular multilevel converters (MMCs) is challenging due to their complex structure consisting of a large number of submodules (SMs). In the literature, the computational speed is emphasized for MMC modeling in real-time simulation, while accurate and detailed information of insulated-gate bipolar transistor (IGBT) modules in SMs is sacrificed. A novel datasheet-based device-level electrothermal model for an MMC on the field programmable gate array (FPGA) is presented in this paper for real-time hardware emulation. Conduction and switching power losses, junction temperatures, temperature-dependent electrical parameters, and linearized switching transient waveforms of IGBT modules are adequately captured in the proposed model. Simultaneously the system-level behavior of the MMC is accurately modeled. Five-level and nine-level MMC systems are emulated in the hardware with the time step of 10 μs and 10 ns for system-level and device-level computations, respectively. The paralleled and pipelined hardware design using IEEE 32-bit floating point number precision runs on Xilinx Virtex-7 XC7VX485T device. The emulated real-time results by an oscilloscope have been validated by offline simulation on SaberRD software. |
---|---|
Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 0885-8993 1941-0107 |
DOI: | 10.1109/TPEL.2015.2503281 |