Wood-derived copper–graphite composites produced via additive-assisted electrodeposition

• Published in: Composites science and technology Vol. 89; pp. 61 - 68
• Main Authors: Johnson, M.T., Childers, A.S., De Carlo, F., Xiao, X., Faber, K.T.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 13.12.2013; Elsevier
• Subjects: A. Functional composites; Additives; B. Porosity/Voids; COMPOSITES; Copper; Cross-disciplinary physics: materials science; rheology; D. Scanning electron microscopy (SEM); DOPING; ELECTRODEPOSITION; ELECTRODES; Electrolytes; Electroplating; Exact sciences and technology; Graphite; Infiltration; Materials science; Other materials; Physics; Scaffolds; Specific materials; Three dimensional; Wettability; WETTING; WOOD; A. Functional composites; D. Scanning electron microscopy (SEM); B. Porosity/Voids; Electroplating; Quercus rubra; Metallizing; Hardwood; Digital image; Fagaceae; Experimental study; Computerized tomography; Composite materials; Dicotyledones; Morphology; Angiospermae; Graphite; Surface properties; Electrodeposition; Spermatophyta; Porosity; Copper; Graphitization
• ISSN: 0266-3538; 1879-1050
• DOI: 10.1016/j.compscitech.2013.09.010

An additive-assisted copper electroplating technique designed for infiltrating high-aspect-ratio pores was adapted to work with three-dimensional wood-derived graphitic scaffolds with aspect ratios ranging from 15 to 300. The poor wettability of the carbon/copper system necessitates the development of alternative infiltration techniques to produce composite structures from highly porous precursors such as wood-derived graphite. By incorporating electrolyte additives, copper infiltration was demonstrated into red oak-derived graphite scaffolds, producing a composite with a biologically-derived microstructure. Copper infiltration was studied as a function of electrolyte chemistry and deposition time in two dimensions using electron microscopy techniques and in three dimensions using X-ray computed tomography.