Fabrication and thermal performance of grooved-sintered wick heat pipe

Some novel grooved-sintered composite wick heat pipes (GSHP) were developed for the electronic device cooling. The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering. The wick could be divided into two parts for liquid capi...

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Bibliographic Details
Published inJournal of Central South University Vol. 21; no. 2; pp. 668 - 676
Main Authors Jiang, Le-lun, Tang, Yong, Wu, Hui-yue, Zhou, Wei, Jiang, Lin-zhen
Format Journal Article
LanguageEnglish
Published Heidelberg Central South University 01.02.2014
Subjects
Engineering
Metallic Materials
thermal resistance
heat transfer limit
wick
heat pipe
electronics cooling
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ISSN2095-2899
2227-5223
DOI10.1007/s11771-014-1987-3

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Summary:Some novel grooved-sintered composite wick heat pipes (GSHP) were developed for the electronic device cooling. The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering. The wick could be divided into two parts for liquid capillary pumping flow: groove sintered zone and uniform sintered zone. Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built. Compared with the theoretical values, the heat transfer limit and thermal resistance of GSHP were measured from three aspects: copper powder size, wick thickness and number of micro grooves. The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit. Given certain copper powder size and wick thickness, the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.
ISSN:2095-2899
2227-5223
DOI:10.1007/s11771-014-1987-3