Communication-Micro-Scale Columnar Architecture Composed of Copper Nano Sheets by Electrodeposition Technique

Micro-scale columnar architectures composed of copper sheets with nanometer thickness were fabricated by electrodeposition using a photolithography technique. A copper sulfate solution containing a polyacrylic acid was used as the plating bath, and the electrodeposition was conducted under galvanost...

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 164; no. 2; pp. D72 - D74
Main Authors Arai, Susumu, Ozawa, Masaya, Shimizu, Masahiro
Format Journal Article
LanguageEnglish
Published The Electrochemical Society 01.01.2017
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Summary:Micro-scale columnar architectures composed of copper sheets with nanometer thickness were fabricated by electrodeposition using a photolithography technique. A copper sulfate solution containing a polyacrylic acid was used as the plating bath, and the electrodeposition was conducted under galvanostatic conditions. Patterned electrodeposits with a cylindrical shape and composed of thin copper sheets were formed. Every copper deposit had openings on the top and side regions and also had a porous interior. This novel three-dimensional (3D) copper architecture should provide functional copper electrodes with large effective surface areas.
Bibliography:1101702JES
ISSN:0013-4651
1945-7111
DOI:10.1149/2.1101702jes