Electrochemical deposition of nickel/SiC composites in the presence of surfactants
This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a...
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| Published in | Materials chemistry and physics Vol. 87; no. 1; pp. 67 - 74 |
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| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
01.09.2004
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| Subjects | |
| Online Access | Get full text |
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| Abstract | This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a high percentage of uniformly distributed SiC particles can be deposited. The adsorption of surfactant CTAB on the SiC particles increases with increasing concentration of CTAB. The enhancement of adhesion between particles and the cathode increases the possibility of embedding larger particles. The effect of surfactant on the codeposition behaviors of SiC particles was explained through the concept of effective particle. |
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| AbstractList | Composite electroplating is a method of codepositing fine particles of metallic, non-metallic compounds or polymers in the plated layer to improve material properties such as wear resistance, lubrication, or corrosion resistance. This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a high percentage of uniformly distributed SiC particles can be deposited. The adsorption of surfactant CTAB on the SiC particles increases with increasing concentration of CTAB. The enhancement of adhesion between particles and the cathode increases the possibility of embedding larger particles. The effect of surfactant on the codeposition behaviors of SiC particles was explained through the concept of effective particle. (Substrate: low carbon steel.) This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a high percentage of uniformly distributed SiC particles can be deposited. The adsorption of surfactant CTAB on the SiC particles increases with increasing concentration of CTAB. The enhancement of adhesion between particles and the cathode increases the possibility of embedding larger particles. The effect of surfactant on the codeposition behaviors of SiC particles was explained through the concept of effective particle. |
| Author | Ger, Ming-Der |
| Author_xml | – sequence: 1 givenname: Ming-Der surname: Ger fullname: Ger, Ming-Der email: mdger@ccit.edu.tw organization: Electrochemical Microfabrication Lab., Department of Applied Chemistry, Chung Cheng Institute of Technology, National Defense University, Ta-His, Tao-Yuan 335, Taiwan, ROC |
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| Snippet | This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results... Composite electroplating is a method of codepositing fine particles of metallic, non-metallic compounds or polymers in the plated layer to improve material... |
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| SubjectTerms | Composites Electrodeposition Nickel SiC Submicron Surfactant |
| Title | Electrochemical deposition of nickel/SiC composites in the presence of surfactants |
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