Electrochemical deposition of nickel/SiC composites in the presence of surfactants

This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a...

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Bibliographic Details
Published inMaterials chemistry and physics Vol. 87; no. 1; pp. 67 - 74
Main Author Ger, Ming-Der
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.09.2004
Subjects
Composites
Electrodeposition
Nickel
SiC
Submicron
Surfactant
Submicron
Electrodeposition
Composites
Nickel
SiC
Surfactant
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Summary:This study investigated the effect of the surfactant and the concentration of SiC particle on the codeposition of SiC in the Ni layer. Experimental results showed that the addition of cetyltrimethylammonium bromide (CTAB) can reduce the agglomerization of SiC particles in the plating bath so that a high percentage of uniformly distributed SiC particles can be deposited. The adsorption of surfactant CTAB on the SiC particles increases with increasing concentration of CTAB. The enhancement of adhesion between particles and the cathode increases the possibility of embedding larger particles. The effect of surfactant on the codeposition behaviors of SiC particles was explained through the concept of effective particle.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0254-0584
1879-3312
DOI:10.1016/j.matchemphys.2004.04.022