4H-SiC MOSFET Threshold Voltage Instability Evaluated via Pulsed High-Temperature Reverse Bias and Negative Gate Bias Stresses

This paper presents a reliability study of a conventional 650 V SiC planar MOSFET subjected to pulsed HTRB (High-Temperature Reverse Bias) stress and negative HTGB (High-Temperature Gate Bias) stress defined by a TCAD static simulation showing the electric field distribution across the SiC/SiO inter...

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Bibliographic Details
Published inMaterials Vol. 17; no. 8; p. 1908
Main Authors Anoldo, Laura, Zanetti, Edoardo, Coco, Walter, Russo, Alfio, Fiorenza, Patrick, Roccaforte, Fabrizio
Format Journal Article
LanguageEnglish
Published Switzerland MDPI AG 01.04.2024
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Summary:This paper presents a reliability study of a conventional 650 V SiC planar MOSFET subjected to pulsed HTRB (High-Temperature Reverse Bias) stress and negative HTGB (High-Temperature Gate Bias) stress defined by a TCAD static simulation showing the electric field distribution across the SiC/SiO interface. The instability of several electrical parameters was monitored and their drift analyses were investigated. Moreover, the shift of the onset of the Fowler-Nordheim gate injection current under stress conditions provided a reliable method to quantify the trapped charge inside the gate oxide bulk, and it allowed us to determine the real stress conditions. Moreover, it has been demonstrated from the cross-correlation, the TCAD simulation, and the experimental ΔV and ΔV variation that HTGB stress is more severe compared to HTRB. In fact, HTGB showed a 15% variation in both ΔV and ΔV , while HTRB showed only a 4% variation in both ΔV and ΔV . The physical explanation was attributed to the accelerated degradation of the gate insulator in proximity to the source region under HTGB configuration.
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ISSN:1996-1944
1996-1944
DOI:10.3390/ma17081908