Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

• Published in: Polymers Vol. 14; no. 3; p. 649
• Main Authors: He, Jian-Jun, Yang, Hai-Xia, Zheng, Feng, Yang, Shi-Yong
• Format: Journal Article
• Language: English
• Published: Switzerland MDPI AG 08.02.2022; MDPI
• Subjects: Dielectric loss; Dielectric properties; Dipoles; Elastic properties; Electric fields; Fluorination; Fourier transforms; Glass transition temperature; Mechanical properties; Modulus of elasticity; Molecular dynamics; Molecular structure; Nitrogen; Polymers; Simulation; Spectrum analysis; Temperature; Tensile strength; Thermal decomposition; Thermal stability; China; molecular chain orientation; fluorinated aromatic polyimide; low dielectric loss; molecular dynamics simulation
• ISSN: 2073-4360; 2073-4360
• DOI: 10.3390/polym14030649

Fluorinated aromatic polyimide (FAPI) films with rigid polymer backbones have been prepared by chemical imidization approach. The polyimide films exhibited excellent mechanical properties including elastic modulus of up to 8.4 GPa and tensile strength of up to 326.7 MPa, and outstanding thermal stability including glass transition temperature (Tg) of 346.3–351.6 °C and thermal decomposition temperature in air (Td5) of 544.1–612.3 °C, as well as high colorless transmittance of >81.2% at 500 nm. Moreover, the polyimide films showed stable dielectric constant and low dielectric loss at 10–60 GHz, attributed to the close packing of rigid polymer backbones that limited the deflection of the dipole in the electric field. Molecular dynamics simulation was also established to describe the relationship of molecular structure and dielectric loss.