Synthesis of pyridine-containing diamine and properties of its polyimides and polyimide/hexagonal boron nitride composite films

A pyridine-containing diamine, 4,4′-bis(5-amino-2-pyridinoxy)diphenyl ether, was prepared via a two-step procedure. Based on the diamine, a series of polyimides were prepared by traditional two-step method. The characteristic peaks of polyimides on their fourier transform infrared (FI-IR) spectra in...

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Published inComposites science and technology Vol. 152; pp. 165 - 172
Main Authors Zhang, Shiheng, Li, Xiaoya, Guan, Xiaoxiao, Shi, Yancen, Wu, Kun, Liang, Liyan, Shi, Jun, Lu, Mangeng
Format Journal Article
LanguageEnglish
Published Barking Elsevier Ltd 10.11.2017
Elsevier BV
Subjects
Boron nitride
Casting
Chemical compounds
Composite materials
Differential scanning calorimetry
Dynamic mechanical properties
Fourier transforms
Heat conductivity
Infrared analysis
Infrared spectra
Mechanical analysis
Mechanical properties
Polyimide resins
Polymer-matrix composites (PMCs)
Thermal analysis
Thermal conductivity
Thermal properties
Thermogravimetric analysis
Ultraviolet spectra
Thermal properties
Casting
Polymer-matrix composites (PMCs)
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Summary:A pyridine-containing diamine, 4,4′-bis(5-amino-2-pyridinoxy)diphenyl ether, was prepared via a two-step procedure. Based on the diamine, a series of polyimides were prepared by traditional two-step method. The characteristic peaks of polyimides on their fourier transform infrared (FI-IR) spectra indicated full imidization. Thermogravimetric analysis (TGA), dynamical mechanical analysis (DMA), differential scanning calorimetry (DSC) and ultraviolet–visible (UV-vis) spectra data showed that the polyimides displayed good properties. Polyimide/hexagonal boron nitride (PI/hBN) composite films were prepared, 3,3′,4,4′-benzophenonetetracarboxylic dianhydride based polyimide (PI-2) was used as the matrix. In addition, the effects of hBN content on the thermal conductivity (TC) of PI/hBN composites films were investigated. The TC of pure PI-2 was 0.148 W m−1 K−1, when the hBN content increased to 40 wt %, the TC increased to 0.686 W m−1 K−1. The enhancement in this TC value was as high as 460% compared to pure PI-2. Meanwhile, the PI/hBN composites films retained excellent thermal and dynamic mechanical properties.
ISSN:0266-3538
1879-1050
DOI:10.1016/j.compscitech.2017.09.026