Addendum: Modular heat sinks for desktop computers and other electronics

• Published in: IEEE transactions on device and materials reliability Vol. 4; no. 4; pp. 638 - 640
• Main Authors: Klett, J.W., Trammell, M.
• Format: Magazine Article
• Language: English
• Published: New York IEEE 01.12.2004; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Aluminum; Bonding; Copper; Devices; Electronic devices; Electronic packaging thermal management; Electronics; Electronics cooling; Evaporative cooling; Foams; Heat sinks; Modular; Resistance heating; Temperature; Thermal force; Thermal resistance

The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat...