Addendum: Modular heat sinks for desktop computers and other electronics

The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat...

Full description

Saved in:
Bibliographic Details
Published inIEEE transactions on device and materials reliability Vol. 4; no. 4; pp. 638 - 640
Main Authors Klett, J.W., Trammell, M.
Format Magazine Article
LanguageEnglish
Published New York IEEE 01.12.2004
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Aluminum
Bonding
Copper
Devices
Electronic devices
Electronic packaging thermal management
Electronics
Electronics cooling
Evaporative cooling
Foams
Heat sinks
Modular
Resistance heating
Temperature
Thermal force
Thermal resistance
Online AccessGet full text

Cover

More Information
Summary:The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1530-4388
1558-2574
DOI:10.1109/TDMR.2004.836731