Addendum: Modular heat sinks for desktop computers and other electronics
The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat...
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| Published in | IEEE transactions on device and materials reliability Vol. 4; no. 4; pp. 638 - 640 |
|---|---|
| Main Authors | , |
| Format | Magazine Article |
| Language | English |
| Published |
New York
IEEE
01.12.2004
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subjects | |
| Online Access | Get full text |
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| Abstract | The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks. |
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| AbstractList | The evaporative cooling technique described in this paper is uniquely suited to systems where the chip or actual electronic device can be bonded directly to the graphite foam and then immersed in the cooling fluid. It is desired, however, to adapt this technology to stand alone and aftermarket heat sinks for desktop computers and electronic devices. This would be suitable for either OEM or aftermarket heat sinks if the thermal resistance can be similar to the state of the art aluminum and copper finned heat sinks. |
| Author | Klett, J.W. Trammell, M. |
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| Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2004 |
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| SubjectTerms | Aluminum Bonding Copper Devices Electronic devices Electronic packaging thermal management Electronics Electronics cooling Evaporative cooling Foams Heat sinks Modular Resistance heating Temperature Thermal force Thermal resistance |
| Title | Addendum: Modular heat sinks for desktop computers and other electronics |
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