Crack Resistance Evaluation Method of Photoimageable Dielectrics for Redistribution Layer

• Published in: Journal of Photopolymer Science and Technology Vol. 37; no. 3; pp. 341 - 344
• Main Authors: Takeuchi, Kenichi, Koga, Chiharu, Shibata, Tomoaki, Aoki, Yu, Aoki, Yukika
• Format: Journal Article
• Language: English; Japanese
• Published: Hiratsuka The Society of Photopolymer Science and Technology(SPST) 25.06.2024; Japan Science and Technology Agency
• Subjects: Crack propagation; Crack resistance; Electronic components; Electronic packaging; Fanout; Load resistance; Material properties; Performance evaluation; Photoimageable dielectric; Redistribution layer; Reliability; Technology assessment; Tensile properties; Tensile tests; Thermal cycle test; Thermal resistance
• ISSN: 0914-9244; 1349-6336
• DOI: 10.2494/photopolymer.37.341

Expectation for advanced packaging technology has been raised due to increase in demand for small and high performance electronic components. In particular, FO-PKG (Fan-Out Package) is recognized as one of the most important package structures to realize high-density integration effectively. Redistribution technology is essential in FO-PKG and photoimageable dielectric for redistribution layer has been focused as the key material to meet the requirements such as package reliability. Crack resistance of the photoimageable dielectric in TCT (Thermal Cycle Test) is one of the important criteria to determine the package reliability. However, fabrication and evaluation of the TEG (Test Element Group) for TCT take a long time because of their complicated procedure. Therefore, clarification of influential material properties on crack resistance is crucial to accelerate material development. In this study, we focused on the relationship between tensile properties and crack resistance. We found out the correlationship between the result of repeated-load tensile test and the crack resistance.