A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd Activation

Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced to Cu electrodeposition on ITO. Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-...

Full description

Saved in:
Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 42; no. Part 2, No.9A/B; pp. L1080 - L1082
Main Authors Kim, Jae Jeong, Kim, Soo-Kil, Kim, Yong Shik
Format Journal Article
LanguageEnglish
Published 15.09.2003
Online AccessGet full text

Cover

More Information
Summary:Surface modification using the two-step wet activation method consisting of Sn sensitization and Pd activation was introduced to Cu electrodeposition on ITO. Pd particles formed on the ITO surface through two-step Sn-Pd activation mediated the electron transfer at the interface and resulted in high-density instantaneous nucleation. Unlike the sparse cluster-type deposits on bare ITO, Cu electrodeposition on Sn-Pd activated ITO enabled the deposition of bright, continuous, and (111)-predominant Cu films on seedless ITO substrate. 17 refs.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0021-4922
DOI:10.1143/JJAP.42.L1080