A mixed XFEM and CZM approach for predicting progressive failure in advanced SiC/SiC CMC component

•Extended finite element method (XFEM) and cohesive element (CE) methodology were used to simulate different fracture modes in SiC/SiC CMC.•Matrix-cracking phenomenon was dependent on XFEM damage criteria.•Serrations in force-displacement curves due to delamination in CE layers matched the experimen...

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Bibliographic Details
Published inComposites. Part C, Open access Vol. 9; p. 100325
Main Authors Patel, Amit, Sato, Eiichi, Shichijo, Naohiro, Hirata, Ichiro, Takagi, Takeshi
Format Journal Article
LanguageEnglish
Published Elsevier B.V 01.10.2022
Elsevier
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Summary:•Extended finite element method (XFEM) and cohesive element (CE) methodology were used to simulate different fracture modes in SiC/SiC CMC.•Matrix-cracking phenomenon was dependent on XFEM damage criteria.•Serrations in force-displacement curves due to delamination in CE layers matched the experimental results. This research work focused on simulating different fracture modes in the high-stress concentrated region of an advanced SiC/SiC CMC component at the macroscopic scale in consideration of increasing cost and time during experimental tests of CMCs. A hybrid of extended-finite-element-method (XFEM) and cohesive-zone-modeling (CZM) was utilized to predict mode-I and mode-II fracture behavior, respectively. The cohesive element (CE) layers were used as fiber-tow interfaces in the stress-concentrated region where mode-II failure was supposed to occur. The 1st crack initiation and its further propagation were found to be dependent on XFEM damage criteria, whereas delamination was observed at the damage-front CE layers. The simulated force-displacement relationships were compared with the experimental ones, where stiffness and serrations in the force-displacement curve corresponding to the delamination matched quite well. With concern to predicting the fracture behavior in a complex-shape component of SiC/SiC CMCs, XFEM with CZM methodology can be a reliable method in the near future. [Display omitted]
ISSN:2666-6820
2666-6820
DOI:10.1016/j.jcomc.2022.100325