The package integration of RF-MEMS switch and control IC for wireless applications

• Published in: IEEE transactions on advanced packaging Vol. 26; no. 3; pp. 255 - 260
• Main Authors: De Silva, A.P., Hughes, H.G.
• Format: Journal Article
• Language: English
• Published: Piscataway, NY IEEE 01.08.2003; Institute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Application specific integrated circuits; Applied sciences; Circuit properties; CMOS integrated circuits; Design. Technologies. Operation analysis. Testing; Diodes; Electric, optical and optoelectronic circuits; Electronic circuits; Electronics; Exact sciences and technology; FETs; Integrated circuit packaging; Integrated circuits; Micro- and nanoelectromechanical devices (mems/nems); Microelectromechanical systems; Microswitches; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device packaging; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Switches; Switching, multiplexing, switched capacity circuits; Control circuit; Critical parameter; RF MEMS switch; isolation; Radiofrequency; Field effect transistor; Low voltage; Control IC; MEMS packaging; hermeticity; Electronic packaging; Integrated circuit; Insertion loss; Logic control; Portable equipment; CMOS integrated circuits; Selector switch; p i n diode; Microelectromechanical device
• ISSN: 1521-3323; 1557-9980
• DOI: 10.1109/TADVP.2003.818056

The integration of microelectromechanical systems (MEMS) switch and control integrated circuit (IC) in a single package was developed for use in next-generation portable wireless systems. This packaged radio-frequency (RF) MEMS switch exhibits an insertion loss under -0.4 dB, and isolation greater than -45 dB. This MEMS switch technology has significantly better RF characteristics than conventional PIN diodes or field effect transistor (FET) switches and consumes less power. The RF MEMS switch chip has been integrated with a high voltage charge pump plus control logic chips into a single package to accommodate the low voltage requirements in portable wireless applications. This paper discusses the package assembly process and critical parameters for integration of MEMS devices and bi-complementary metal oxide semiconductor (CMOS) control integrated circuit (IC) into a single package.