Monolithic integration of RF MEMS switches with a diversity antenna on PCB substrate

A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90/spl deg/C-170/spl deg/C) high-density inductively coup...

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Bibliographic Details
Published inIEEE transactions on microwave theory and techniques Vol. 51; no. 1; pp. 332 - 335
Main Authors Cetiner, B.A., Qian, J.Y., Chang, H.P., Bachman, M., Li, G.P., De Flaviis, F.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.01.2003
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Chemical elements
Laminates
Micromechanical devices
Microwave antennas
Monolithic integrated circuits
Plasma properties
Printed circuits
Radiofrequency microelectromechanical systems
Switches
Switching circuits
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Summary:A novel process for monolithic integration of RF microelectromechanical system (MEMS) switches with three-dimensional antenna elements on a microwave laminate printed circuit board (PCB) is presented. This process calls for a low-temperature (90/spl deg/C-170/spl deg/C) high-density inductively coupled plasma chemical vapor deposition technique that allows the choice of any PCB substrate, such as RO4003-FR4 (/spl epsiv//sub r/=3.38, tan/spl delta/=0.002), with the desired electrical properties for antenna applications. A two-element diversity antenna system monolithically integrated with RF MEMS switches is designed and demonstrated.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2002.806521