The deposition of copper-based thin films via atmospheric pressure plasma-enhanced CVD

• Published in: Surface & coatings technology Vol. 230; pp. 260 - 265
• Main Authors: Hodgkinson, John L., Massey, David, Sheel, David W.
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 15.09.2013; Elsevier
• Subjects: Activation; Antibacterial coatings; Applied sciences; Atmospheric pressure; Atmospherics; CHEMICAL VAPOR DEPOSITION; COMPOSITES; Copper; Cross-disciplinary physics: materials science; rheology; CVD; DEPOSITION; Exact sciences and technology; Film growth; Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; MICROSTRUCTURES; Nanostructure; Physics; Plasma; PLASMAS; Production techniques; Reels; Surface treatment; Surface treatments; THIN FILMS; VAPOR DEPOSITION; X RAY SPECTROSCOPY; X-ray photoelectron spectroscopy; Thin films; CVD; Plasma; Antibacterial coatings; Atmospheric pressure; Copper; Surface treatments; Coatings
• ISSN: 0257-8972; 1879-3347
• DOI: 10.1016/j.surfcoat.2013.06.053

This work reports for the first time, deposition of copper via an atmospheric pressure-based plasma CVD system. We describe the deposition of both metallic copper and copper/silica-like nano-composite films with composition dependant on, and controlled by, the power applied to the discharge. This is significant, suggesting the potential to select materials properties by control of plasma activation to favour a particular reaction mechanism. The plasma enables film growth under 200°C, allowing the use of many thermally sensitive substrates. In addition, the approach is scale-able to large areas and may be integrated as a continuous reel to reel process. The films are characterised by XPS, XRD and SEM, with film growth correlated to process conditions. Activity testing of the composite films showed complete killing of Escherichia coli after 1h, demonstrating the potential for further development and exploitation. •Copper films produced via atmospheric pressure plasma-enhanced CVD.•Growth temperature below 200°C.•Nano-composite copper/silica-like films investigated as an antimicrobial surface for the protection of large areas.•Potential to assist infection control in areas such as hospitals or food processing facilities.