Low-stress diamond-like carbon films containing carbon nanoparticles fabricated by combining rf sputtering and plasma chemical vapor deposition

Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm−3. The film stress is dec...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 59; no. 10; pp. 100906 - 100909
Main Authors Hwang, Sung-Hwa, Okumura, Takamasa, Kamataki, Kunihiro, Itagaki, Naho, Koga, Kazunori, Nakatani, Tatsuyuki, Shiratani, Masaharu
Format Journal Article
LanguageEnglish
Published Tokyo IOP Publishing 01.10.2020
Japanese Journal of Applied Physics
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Summary:Carbon nanoparticles (CNPs) incorporated diamond-like carbon (DLC) films have been fabricated by a combination of rf sputtering and plasma chemical vapor deposition. Spherical CNPs with a mean size of 21.2 nm are sandwiched between DLC layers with a mass density of 1.7 g cm−3. The film stress is decreased to 119 MPa, by depositing the CNPs over the base DLC layer at a surface coverage of 10.7%. This reduction is approximately half of that without CNPs. Raman spectroscopy indicates the insertion of CNPs barely alters the bonding structure of the upper DLC layer.
Bibliography:JJAP-102839.R1
ISSN:0021-4922
1347-4065
DOI:10.35848/1347-4065/abbb20