Effects of filler shape and size on the properties of silver filled epoxy composite for electronic applications

• Published in: Journal of materials science. Materials in electronics Vol. 22; no. 1; pp. 56 - 63
• Main Authors: Suriati, G., Mariatti, M., Azizan, A.
• Format: Journal Article
• Language: English
• Published: Boston Springer US 01.01.2011; Springer; Springer Nature B.V
• Subjects: Characterization and Evaluation of Materials; Chemistry and Materials Science; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronic transport in multilayers, nanoscale materials and structures; Exact sciences and technology; Materials Science; Nanopowders; Nanoscale materials and structures: fabrication and characterization; Optical and Electronic Materials; Physics; Thermal expansion; thermomechanical effects and density; Thermal properties of condensed matter; Thermal properties of crystalline solids; Thermal properties of small particles, nanocrystals, nanotubes; Silver Nanoparticles; Flexural Strength; Percolation Threshold; Dynamic Mechanical Analysis; Epoxy Composite; Nanoparticles; Silver; Thermal expansion; Electrical conductivity; Spherical shape; Composite materials; Fillers; Flexural strength; Dynamic mechanical analysis
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-010-0082-2

Epoxy composites filled with nano- and micro-sized silver (Ag) particulate fillers were prepared and characterized based on flexural properties, coefficient of thermal expansion, dynamic mechanical analysis, electrical conductivity, and morphological properties. The influences of these two types of Ag fillers, especially in terms of their sizes and shapes, were investigated. Silver nanoparticles were nano-sized and spherical, while silver flakes were micron-sized and flaky. It was found that the flexural strength of the epoxy composite filled with silver flakes decreased, while the flexural strength of the epoxy composite filled with silver nanoparticles showed an optimum value at 4 vol.% before it subsequently dropped. Both silver composites showed improvement in flexural modulus with increasing filler loads. CTE value indicated significant decrements in filled samples compared to neat epoxy. Results on the electrical conductivity of both systems showed a transition from insulation to conduction at 6 vol.%.