An overview of rheology in the computer industry

The rheological characterization of a wide variety of materials used in computer hardware is described. The materials and applications presented include liquid crystal polymers for components, solder paste for surface mounting of integrated circuits, screen printable polyimide for dielectric pattern...

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Bibliographic Details
Published inJournal of applied polymer science Vol. 59; no. 9; pp. 1405 - 1416
Main Author Karis, T. E.
Format Journal Article
LanguageEnglish
Published New York Wiley Subscription Services, Inc., A Wiley Company 28.02.1996
Wiley
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Summary:The rheological characterization of a wide variety of materials used in computer hardware is described. The materials and applications presented include liquid crystal polymers for components, solder paste for surface mounting of integrated circuits, screen printable polyimide for dielectric patterns, new photosensitive polyimide to reduce processing steps, hot‐melt adhesive for temporary bonding, pressure‐sensitive adhesive for permanent bonding of potical recording disks, bearing grease for magnetic recording disk drive spindles, fluoropolymer lubricants for magnetic recording disks, magnetic particle suspensions for magnetic tape and disks, toner for laser printing, thermoplastic polymer for rapid prototyping, and cathode paste for rechargeable lithium batteries. Rheological tests appropriate for each of the materials were designed to provide key information about its performance in the intended application. This overview provides insight into the relation between interpretation of rheological test data and materials performance in engineering applications as well as for process control. Rheology is essential to the development of computer hardware and peripheral devices. © 1996 John Wiley & Sons, Inc.
Bibliography:ark:/67375/WNG-QVWL0WTD-D
ArticleID:APP8
istex:DFFDFFC14C96B53599458393665A6FE618075E41
ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0021-8995
1097-4628
DOI:10.1002/(SICI)1097-4628(19960228)59:9<1405::AID-APP8>3.0.CO;2-F