High-performance, flexible thermoelectric generator based on bulk materials
Flexible thermoelectric generators (f-TEGs) are promising solutions to power supply for wearable devices. However, the high fabrication costs and low output power density of conventional f-TEGs limit their applications. Here, we present a bulk-material-based f-TEG featuring multifunctional copper el...
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Published in | Cell reports physical science Vol. 3; no. 3; p. 100780 |
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Main Authors | , , , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier Inc
16.03.2022
Elsevier |
Subjects | |
Online Access | Get full text |
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Summary: | Flexible thermoelectric generators (f-TEGs) are promising solutions to power supply for wearable devices. However, the high fabrication costs and low output power density of conventional f-TEGs limit their applications. Here, we present a bulk-material-based f-TEG featuring multifunctional copper electrodes for heat concentration and dissipation and fabrics for comfort and heat-leakage reduction. When worn on the forehead, our f-TEG’s maximum output power density (based on the device’s area) reaches 48 μW/cm2 at a wind speed of 2 m/s and an ambient temperature of 15°C. A light-emitting diode (LED) powered by our f-TEG headband with 100 pairs of thermoelectric pillars can illuminate a paper for reading in a dark room at 17.5°C without an external heat sink or forced convection at the cold side. This work provides a general design approach for high-performance f-TEGs at a low cost. The device-level perspectives fill the critical knowledge gap between state-of-the-art material innovations and practical thermoelectric applications.
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•A mushroom-like f-TEG achieves high output power density on human skin•The copper electrodes also serve as heat concentrators and spreaders and spacers•An analytical model is developed to predict an f-TEG’s energy-harvesting performance
Xu et al. report an f-TEG featuring a mushroom-like structure that achieves high output power density on human skin without external heat sink via thermal design. The work provides an example of the design process of f-TEGs and paves the pathway toward scalable fabrication of low-cost and high-performance f-TEGs. |
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ISSN: | 2666-3864 2666-3864 |
DOI: | 10.1016/j.xcrp.2022.100780 |