Effect of Curing Procedure on the Properties of Copper-Powder-Filled Conductive Adhesives

• Published in: Journal of Wuhan University of Technology. Materials science edition Vol. 23; no. 3; pp. 323 - 325
• Main Authors: Zheng, Xiaoling, Zhang, Lulu, You, Min, Wu, Jianhao, Yu, Haizhou, Yang, Derong, Mao, Yuping
• Format: Journal Article
• Language: English
• Published: Heidelberg Wuhan University of Technology 01.06.2008; Springer Nature B.V; College of Mechanical and Material Engineering, China Three Gorges University, Yichang 443002, China%School of Physics Science and Technology, Central South University, Changsha 410083, China
• Subjects: Adhesives; Chemistry and Materials Science; Materials Science; Metallurgy; Residual stress; Shear strength; Studies; 传导性; 养护过程; 环氧树脂; 粘合剂; copper-powder-filled; curing procedure; conductive adhesives; epoxy
• ISSN: 1000-2413; 1993-0437
• DOI: 10.1007/s11595-007-3323-3

By means of testing the shear strength with single lap joint, measuring electrical resistivity for cured products and the curing strain with strain gauges, the effect of cure parameters on the properties of HT1012 conductive adhesive filled with copper powder was investigated, and the residual stress in the conductive adhesives was also estimated. The experimental results show that the properties such as shear strength of the adhesives, electrical resistivity of products as well as the residual stress of cured HT 1012 copperfitted conductive adhesive were evidently affected by curing temperature and time. The diagrams of scanning electron microscopy （SEM） and Fourier transform infrared （FT-IR） were also used to determine the properties. The higher mechanical property was achieved under the condition of curing the adhesive 3 h at 60 ℃ as the density of the hydrogen links or linkages existed in the adhesive was relatively higher and the lower electrical resistivity occurred at 80 ℃.