Synthesis of polyimides containing triazole to improve their adhesion to copper substrate

• Published in: Journal of adhesion science and technology Vol. 16; no. 13; pp. 1839 - 1851
• Main Authors: Seo, Jeonghoon, Kang, Jeonghoon, Cho, Kilwon, Park, Chan Eon
• Format: Journal Article
• Language: English
• Published: Leiden Taylor & Francis Group 01.01.2002; Brill
• Subjects: adhesion strength; Applied sciences; copper; Exact sciences and technology; Organic polymers; Physicochemistry of polymers; Polycondensation; polyimide; polyisoimide; Preparation, kinetics, thermodynamics, mechanism and catalysts; triazole; Adhesivity; Triazole; Triazole derivative copolymer; Property composition relationship; Mechanical properties; Condensation polymerization; Experimental study; Thermal stability; polyisoimide; Chemical modification; adhesion strength; polyimide; Imidation; Preparation; Surface properties; Aromatic copolymer; Imide copolymer; Copper
• ISSN: 0169-4243; 1568-5616
• DOI: 10.1163/156856102320396175

3,5-diamino-1,2,4-triazole(DATA) was used as a diamine to introduce triazole in the backbone of polyimides. The mol% of DATA in the diamines was varied and the effects of triazole content on the mechanical properties, thermal properties and adhesion strength between polyimides and copper were investigated. Polyisoimides were also synthesized to prevent the copper diffusion into polyimide layer observed in poly(amic acid) precursors. The properties of polyimides prepared via polyisoimide including the adhesion strength to copper were examined. The locus of failure of polyimide/Cu joints was analyzed by XPS. The mechanical properties of BOD-PI did not vary with increasing the DATA content from 0 mol% to 20 mol% in diamines but the adhesion strength of BOD-PI/Cu joints increased with increasing the DATA content.