The Domain Decomposition Method with Adaptive Time Step for the Transient Thermal Analysis of 3-D ICs

• Published in: IEEE access Vol. 11; p. 1
• Main Authors: Liu, Na, Wang, Chenyang, Chen, Xi, Wu, Qiuyue, Liu, Qiqiang, Zhuang, Mingwei, Shi, Linlin, Liu, Qing Huo
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.01.2023; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: adaptive time step; Conduction heating; domain decomposition method (DDM); Domain decomposition methods; Electronic devices; Finite element analysis; Free convection; Heating systems; Integrated circuit modeling; Integrated circuits; integrated circuits (ICs); Mathematical models; Mesh generation; Numerical methods; Packaging; Thermal analysis; Transient analysis; Transient heat transfer
• ISSN: 2169-3536; 2169-3536
• DOI: 10.1109/ACCESS.2023.3240957

With the continuous emergence of various advanced packaging technologies such as copper interconnection and 3-D packaging technology, it is essential to efficiently and accurately investigate the thermal analysis of high-performance, high-power and complicated electronic devices to better design heat dissipation structures. However, multiscale transient thermal analysis of complex electronic devices by existing numerical methods is still a challenge. In this work, the 3-D domain decomposition method (DDM) with the adaptive time step for the transient thermal analysis of integrated circuits (ICs) is proposed to tackle this problem. By flexible multiscale mesh generation and automatically time step changes based on posteriori errors, the new method significantly improves computational efficiency. Some illustrative numerical examples are presented to verify the accuracy and efficiency of the proposed method by considering 3-D transient heat transfer with thermal conduction, natural convection and radiation boundaries.