A brief review of selected aspects of the materials science of ball bonding

Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball–wedge bonding in an attempt to better control and advance its application as an...

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Bibliographic Details
Published inMicroelectronics and reliability Vol. 50; no. 1; pp. 1 - 20
Main Authors Breach, C.D., Wulff, F.W.
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 2010
Elsevier
Subjects
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Thermosonic bonding
Interconnection
Intermetallic compound
Electronic packaging
Integrated circuit
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Summary:Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject of metallurgical analysis. However, in recent years greater focus has been given to the materials science of thermosonic ball–wedge bonding in an attempt to better control and advance its application as an interconnect technology in advanced packaging. As with most materials processes, establishing a scientific understanding of the process requires knowledge from various sub-disciplines of physical science. This article briefly reviews selected aspects of the materials science of ball bonding, focussing on 1st and 2nd bond formation and intermetallic growth.
ISSN:0026-2714
1872-941X
DOI:10.1016/j.microrel.2009.08.003